TWELITE is a microcontroller module with wireless functionality.
By mounting it on a parent board connected to sensors, switches, LEDs, etc., you can build compact wireless devices.
It consumes very little power and can operate for long periods on batteries.
It is suitable for mass production due to its surface-mount compatibility with automated assembly machines.
1 - TWELITE BLUE / RED Wireless Microcontroller
Model: TWE-L-(WX/U) / MW-R-(WX/U)
TWELITE BLUE / RED is the first generation of the TWELITE series.
1.1 - TWELITE Wireless Microcontroller Datasheet
Latest Edition
TWELITE BLUE (Certification Model: TWE-001 Lite) and TWELITE RED (Certification Model: TWELITE RED) are compact modules integrating an ultra-low-power, high-performance microcontroller, flash memory, and a high-performance wireless interface compliant with IEEE802.15.4.
The modules operate by connecting power and sensors, and storing programs in the flash memory or EEPROM. They support SPI, I2C, and UART interfaces, enabling connection to various sensors or microcontrollers.
Certified for use in Japan, these modules can be incorporated into products immediately.
Fine-grained power control for each block (digital/analog/RAM/wireless)
Built-in AES 128-bit encryption circuit and 16-bit random number generator
Interfaces
Qty
Notes
ADC
4/6
10-bit. 4 ports for TWELITE BLUE, 6 ports for TWELITE RED
PWM
4
Timer/PWM
1
5 modes including PWM, Δ∑. 16MHz, 16-bit resolution
Pulse Counter
2
Operates in sleep mode. Max 100kHz, 16-bit
UART
2
16550A compatible
SPIMaster/Slave
1
3 chip selects, up to 16MHz
Comparator
1
2-wire SerialMaster/Slave(I2C, SMBUS compatible)
1
Up to 100kHz or 400kHz, 7/10-bit address modes
General-purpose Digital
20
Shared with other interfaces
Many pins are shared; some combinations may not be available simultaneously.
Certifications and Compliance
TWELITE BLUE
TWELITE RED
Certification Model
TWE-001 Lite
TWELITE RED
Technical Conformity Number
007-AB0031
007-AF0062
FCC ID
2AINN-L1
-
IC ID
21544-L1
-
Notes
RoHS compliant
RoHS compliant
※1. When using TWELITE outside Japan, there may be restrictions on antennas and other components. Please consult us at the early stage of your development.
※2. Depending on the country, it may be necessary to display the FCC ID or IC ID on TWELITE or your product. If applicable, please contact us.
Export Precautions
The built-in AES 128-bit encryption circuit in TWELITE is subject to export control. We will issue an export control statement as needed; please contact us when exporting.
In some countries, customs clearance may not be possible unless TWELITE has obtained local radio certification. Please inquire about regulations for each export destination.
Product Labeling
The product is marked with a logo, certification numbers, etc., which are subject to change without notice.
Block Diagram
External Dimensions
Dimensions: 13.97 × 13.97 × 2.5 mm Weight: 0.93 g
DXF data for TWELITE BLUE/TWELITE RED outlines is available for download from our website.
Recommended Pad Dimensions
The mating PCB contacting the module’s underside must not have silkscreen or through-holes.
When soldering a wire antenna (such as a matchstick antenna), provide a rectangular hole in the mating PCB and solder from the underside of the module. (See Chapter 7 for details.)
Use a metal mask thickness in the range of t=0.12–0.15mm. Depending on the mask and reflow conditions, solder fillets may not form on one side of the module’s half-through-holes.
Antenna Mounting Opening
When mounting TWELITE on your custom PCB, it is efficient to provide an opening for connecting a wire antenna (matchstick antenna) and solder from the underside.
This drawing shows an example of such an opening.
In this example, pins 29, 30, 31, and 32 (NC, GND, GND, GND) are left unconnected to allow for a larger opening.
Note: Connecting GND pins 28, 30–32 on the SMD version is recommended, but operation without connection is also possible. No significant change in wireless performance has been observed even if left unconnected.
Pin Assignment
Pin Numbers
Pin Assignment
# (Note 1)
IO Name (Note 2)
Function Assignment (Note 3)
Alternate Assignment (Note 4)
Super Easy! Standard App Function Name (Note 5)
1
DO0
SPICLK
PWM2(※6)
PWM2
2
DO1
SPIMISO
PWM3(※6)
PWM3
3
DIO18
SPIMOSI
DO1
4
DIO19
SPISEL0
DO2
5
VCC
VCC
VCC
6
DIO4
CTS0
TIM0OUT
PC0
DO3
7
DIO5
RTS0
PWM1
PC1
PWM1
8
DIO6
TXD0
PWM2
TX
9
DIO7
RXD0
PWM3
RX
10
DIO8
TIM0CK_GT
PC1
PWM4
PWM4
11
DIO9
TIM0CAP
32KTALIN
RXD1
DO4
12
DIO10
TIM0OUT
32KTALOUT
M1
13
DIO12
PWM2
CTS0
DI1
14
DIO14
SIF_CLK
TXD1
TXD0
SPISEL1
SCL
15
DIO13
PWM3
RTS0
DI2
16
DIO11
PWM1
TXD1
DI3
17
DIO15
SIF_D
RXD1
RXD0
SPISEL2
SDA
18
DIO16
COMP1P
SIF_CLk
DI4
19
DIO17
COMP1M
PWM4
SIF_D
BPS
20
GND
GND
21
RESETN
RESETN
RST
22
ADC2
VREF
AI3
23
ADC1
AI1
24
DIO0
SPISEL1
ADC3
AI2
25
DIO1
SPISEL2
ADC4
PC0
AI4
26
DIO2
ADC5(※7)
TIM0CK_GT
M2
27
DIO3
ADC6(※7)
TIM0CAP
M3
28
GND
GND
GND
29
NC
RF
N/A
30
GND
GND
GND
31
GND
GND
GND
32
GND
GND
GND
Note 1. Pin number. Note that the number and assignment may differ from TWELITE DIP. IO name is usually used to identify pins.
Note 2. IO name. This is used in semiconductor datasheets, TWELITE app development, and technical support.
Note 3. Each pin can be used as simple I/O or analog input, but can also be initialized for other functions via API. The table lists typical functions.
Note 4. Alternate functions assignable via API. The table lists typical alternate functions.
Note 5. Pin names used by the “Super Easy! Standard App (App_Twelite)”. These are similar to IO names but take care to avoid confusion.
Note 6. PWM2,3 can be assigned to DO0,1 by releasing DIO6,7 or DIO12,13 assignments.
Note 7. ADC5,6 are available only on TWELITE RED.
Function Reference
Signal Name
Function
PC
Pulse Counter
SPICLK
SPI Master Clock
SPISEL
SPI Select Output
SPIMISO
SPI Master Input
SPIMOSI
SPI Master Output
TIM0CK_GT
Timer Clock, Gate Input
TIM0CAP
Timer Capture Input
TIM0OUT
Timer PWM Output
32KTALIN
Crystal Input
32KTALOUT
Crystal Output
VREF
Reference Voltage
COMP1M
Comparator + Input
COMP1P
Comparator - Input
SIF_D
2-wire Serial Data
SIF_CLK
2-wire Serial Clock
RXD
UART RX
TXD
UART TX
RTS
UART RTS
CTS
UART CTS
PWM
Pulse Width Modulation Output
Special Pin Handling
DO0 (Function: SPICLK)
This pin is used as an output.
If an external voltage is applied
(even with some output impedance), there have been reports that the TWE module may fail to enter programming mode. When connecting LEDs or transistors, the pin may enter an intermediate state at startup or wakeup from sleep, possibly causing malfunction. Always use an external circuit that pulls up to Vcc.
DO1 (Function: SPIMISO)
This pin is typically used as an output, but at power-on or reset, it behaves as an input. If a low level is detected at this time, the module boots in programming mode. Pay attention to the
voltage at startup
on this pin.
DIO0 (Function: ADC3), DIO1 (Function: ADC4)
These pins are shared with analog input. In firmware,
the internal pull-up must be disabled when reading AD values
.
ADC2
ADC2 can be used as a reference voltage input. Software implementation is required.
There is no pin for outputting the reference voltage.
GND
Connecting GND pins 28, 30–32 on the SMD version is recommended, but operation without connection is possible. No significant change in wireless performance has been observed even if left unconnected.
Absolute Maximum Ratings
Min
Max
Power Supply (VCC)
-0.3
3.6
V
Analog IO (VREF/ADC)
-0.3
VCC+0.3
V
Digital IO
-0.3
VCC+0.3
V
Characteristics
Recommended Operating Conditions
Symbol
Condition
min
typ
max
Power Supply Voltage
VCC
2.0
3.0
3.6
V
Startup Voltage
Vboot
2.05
V
Operating Temperature
TOPR
No condensation
TWELITE BLUE
-40
25
105(Note 1) 90(Note 2)
°C
TWELITE RED
-30
25
90
Operating Humidity
HOPR
No condensation
85
%RH
*Values are based on semiconductor datasheets. Note 1: Maximum operating temperature for TWE-L-WX/W0/W7 Note 2: Maximum operating temperature for TWE-L-U
DC Characteristics
Symbol
Condition
min
typ
max
Current Consumption
ICC
Sleep (RAMOFF, no timer)
TWELITE BLUE
0.1
uA
TWELITE RED
0.1
uA
Sleep (with timer)
TWELITE BLUE
1.5
uA
TWELITE RED
1.5
uA
Tx (CPU doze)
TWELITE BLUE
15.3
mA
TWELITE RED
23.3
mA
TWELITE RED(at 3dBm output)
14.0
mA
Rx (CPU doze)
TWELITE BLUE
17.0
mA
TWELITE RED
14.7
mA
TX Output Power
Pout
TWELITE BLUE
+0.5
2.5
dBm
TWELITE RED
9.14
dBm
RX Sensitivity
TWELITE BLUE
-95
dBm
TWELITE RED
-96
dBm
*Values are based on semiconductor datasheets.
I/O Characteristics
Symbol
Condition
min
typ
max
DIO Internal Pull-up
40
50
60
kΩ
DIO Hi Input
VIH
VCCx0.7
VCC
V
DIO Lo Input
VIL
-0.3
VCCx0.27
V
DIO Input Hysteresis
200
310
400
mV
DIO Hi Output
VOH
TWELITE BLUE
VCCx0.8
VCC
V
TWELITE RED
VCC-0.4
DIO Lo Output
VOL
0
0.4
V
DIO Sink Current
IOL
VCC 2.7–3.6V
4
mA
VCC 2.2–2.7V
3
mA
VCC 2.0–2.2V
2.5
mA
*Values are based on semiconductor datasheets.
ADC Characteristics
Symbol
Condition
min
typ
max
Reference Voltage
VREF
1.198
1.235
1.260
V
ADC Resolution
10
Bits
ADC Integral Nonlinearity
±1.6, ±1.8
LSB
ADC Differential Nonlinearity
-0.5
0.5
LSB
ADC Offset Error
0–VREF
-10
mV
0–2VREF
-20
ADC Gain Error
TWELITE BLUE0–VREF
+10
mV
TWELITE BLUE0–2VREF
+20
TWELITE RED0–VREF
-10
TWELITE RED0–2VREF
-20
ADC Clock
0.25,0.5, 1.0
MHz
ADC Input Range
0.04
VREF2xVREF
V
*Values are based on semiconductor datasheets.
Reel Specifications
Taping Dimensions
Reel Dimensions
Maximum Module Packaging Quantity
Reel/Inner Box
Quantity/Reel
Outer Box
Quantity
1
1000
1
1000
Reflow Conditions
Recommended Reflow Profile
Reflow profile
Preheating
Main Heating
Peak Temp
Number of Reflows
150180°C/6090sec
220°C/30~45sec
245°C
1 time
Temperature conditions: One reflow within the recommended temperature profile above.
Soldering should be performed by reflow soldering as a general rule.
We have confirmed no issues under the above profile, but please verify solderability under your own manufacturing conditions.
Board Mounting Precautions
Only one reflow process is allowed under our recommended conditions. Note that solder inside the module will re-melt during reflow. Reflow soldering is the principle method.
The product absorbs moisture if left in the natural environment. Mount using reflow within 72 hours after opening.
When storing below the above humidity, ensure proper anti-static measures.
If more than 72 hours have passed after opening, bake under the following conditions before use:
Do not bake reels directly. Transfer to trays, etc., before baking.
Baking conditions: 90°C, 48 hours, up to 1 time.
Please note that multiple lot numbers may be mixed in the same package.
Solder fillets are not required on the soldered parts of components mounted on this product.
This product is intended for mounting on glass epoxy PCBs. If mounting on other materials (e.g., ceramics), evaluate thoroughly before use.
Some internal components are highly sensitive to static electricity. Take adequate ESD precautions.
If stress is applied to the shield case, it may detach. Handle with care.
For hand soldering, follow these conditions: below 350°C, within 3 seconds (surface temperature must not exceed 150°C).
Precautions for Use
Factory Default Application
At the time of shipment (as of this datasheet’s publication), TWELITE is programmed with the “Super Easy! Standard App” firmware. This firmware is intended for production testing during manufacturing. We cannot disclose information about the firmware version or contents programmed on TWELITE, even upon request. In the future, the presence or type of pre-installed firmware may be changed without notice. Please write the required application to TWELITE during your own manufacturing process.
Storage
Store in a cool, dry place. Use the product within six months of delivery.
General Notes
Always evaluate and verify our products in your actual usage environment.
If you intend to use this product in applications requiring high reliability or involving human life, please consult your distributor in advance.
TWELITE wireless module (GOLD Series) is the second generation of TWELITE.
2.1 - TWELITE (GOLD Series)
Latest Edition
Introduction
TWELITE® is a compact, low-power, and high-performance wireless module.
Equipped with an Arm® Cortex®-M4 core, it supports mid-range wireless communication compliant with IEEE802.15.4 and short-range communication compliant with ISO/IEC 14443.
It has obtained domestic radio certification in Japan, enabling rapid productization of wireless systems.
Features
Ultra-compact package (13.97mm × 13.97mm × 2.5mm)
Mid-range wireless communication compliant with global standard IEEE802.15.4
PCB design that maximizes chip performance and ensures stable communication over long distances
A PCB-mountable antenna MW-A-P1934 is also available.
Using antennas not designed for TWELITE requires separate radio certification.
Certifications
ALL
TWELITE (GOLD Series)
Certification Model
TWELITE GOLD
Technical Conformity Certification Number
007-AL0022
When using TWELITE overseas, there may be various restrictions such as on the types of antennas that can be used.
Please contact us during the early stages of development.
NFC Tag
ALL
Item
TWELITE (GOLD Series)
Remarks
Communication
ISO/IEC 14443 Type A
Protocol
NFC Forum Type 2 Tag
NXP® NTAG®
Data Rate
106kbps
SRAM
64bytes
EEPROM
2KB
Write Speed
4.8ms
4bytes, EEPROM
0.8ms
4bytes, SRAM
6.1ms
64bytes, SRAM (FAST_WRITE)
Max Distance
100mm
Depends on antenna configuration
Development Environment
ALL
TWELITE STAGE SDK
TWELITE STAGE SDK is a dedicated firmware development environment for the TWELITE series provided by our company. Using the included application TWELITE STAGE APP, you can build and write firmware, as well as check the operation and change settings of existing firmware.
For usage instructions, refer to the documents included with the TWELITE STAGE SDK.
Documentation on the website may reflect newer versions of TWELITE STAGE SDK and the application, and thus may differ in content from the version you are using.
The TWELITE STAGE SDK consists of the following:
TWELITE STAGE APP (frontend for building, which uses command-line make for compilation and performs firmware writing): all except MWSDK (Note 1) and Tools under MWSTAGE/
Toolchain (utilities and command-line tools such as compiler): under MWSTAGE/Tools
MWSDK library (libraries used in builds): under MWSTAGE/MWSDK (Note 1)
Note 1: The MWSDK folder may contain older library versions. In such cases, folder names like MWSDK20XX_YY are used.
The toolchain gcc and the MWSDK library version directly affect the generated binaries.
Distribution of TWELITE STAGE SDK
The TWELITE STAGE SDK for TWELITE GOLD is distributed through our support service.
Below are the major versions currently available:
MWSTAGE2024_07G distributed in July 2024
STAGE App: 2.4.1
Toolchain: gcc 12.2.1 20221205
MWSDK Library: MWSDK2024_07G
TWELITE GOLD-Specific Development Information
The .../MWSDK/TWENET/current/index.html file under the MWSDK folder contains descriptions about build methods and APIs.
About MCUXpresso
MCUXpresso is a firmware development environment provided by NXP Semiconductors N.V., the manufacturer of the JN5189 semiconductor used in TWELITE (GOLD Series). It allows not only building and writing firmware but also debugging using MCU-Link.
Please note that we do not provide support for tools offered by semiconductor manufacturers.
About Software Licensing
When developing firmware using the TWELITE STAGE SDK provided by Mono Wireless Inc., please refer to the license descriptions in the LICENSE folder under the MWSDK library as the primary source. English versions of the licenses are available, but in the event of any dispute or discrepancy, the Japanese version shall take precedence.
MW-SLA-1E1, MW-OSSLA-1E — English versions of the above
Refer to the license descriptions included in the source code to understand the applicable license.
Source code created by Mono Wireless Inc. is generally licensed under either MW-SLA or MW-OSSLA.
For tool licenses, refer to the distribution directories of the TWELITE STAGE SDK.
For the TWELITE STAGE APP license, refer to the contents under MWSTAGE/TWELITE_Stage/LICENSE in the SDK distribution.
Pin Assignment
Pin Number
SMD
Pin Number Assignment
DIP
Pin Number Assignment (DIP)
Pin Functions
ALL
The typical functions are shown in the table below.
Name
Function
PIO
Peripheral Input/Output
PWM
Pulse Width Modulation Output
TXD
UART Data Transmission
RXD
UART Data Reception
RTS
UART Data Transmission Request Output
CTS
UART Data Transmission Request Input
SCL
I2C Serial Clock
SDA
I2C Serial Data
SCK
SPI Serial Clock
MOSI
SPI Controller Output (PICO)
MISO
SPI Controller Input (POCI)
SSELN
SPI Peripheral Select (CS)
Name
Function
IO
Quad SPI Serial Data
CSN
Quad SPI Chip Select
CLK
Quad SPI Serial Clock
MAT
Timer Output
CAP
Timer Input
OUT
Comparator Output
ACP
Comparator + Input
ACM
Comparator - Input
SWDIO
SWD Serial Data
SWO
SWD Trace Port
SWCLK
SWD Serial Clock
ISPENT
ISP Entry
ISPSEL
ISP Mode Select
The typical assignments of functions are shown in the table below.
SMD# Note1
DIP# (14P) Note1
IO Note2
PWM Note3
ADC Note3
UART Note3
I2C Note3
SPI Note3
Quad SPI Note3
Timer (CT32) Note3
Comparator Note3
SWD ISP Note3
1
6
PIO0
PWM0
TXD1
SCK1
2
7(PRG)
PIO5
RTS0
SSELN0MISO1SSELN1(2)
ISPENT
3
5
PIO2
PWM2
RXD0
SCK0MOSI1
4
8
PIO3
PWM3
TXD0
MISO0SSELN1(0)
5
28(VCC)
VCC
6
9
PIO7
PWM7
CTS0RXD1
SDA1
MISO0
CT32B1MAT1
7
4
PIO6
PWM6
RTS0TXD1
SCL1
SCK0
CT32B1MAT0
8
10(TXD)
PIO8
PWM8
TXD0
MOSI0
CT32B0MAT0
OUT
9
3(RXD)
PIO9
PWM9
RXD0
SSELN0
CT32B1CAP1
10
11(A)
PIO14
PWM1
ADC0
SSELN1(1)
CT32B0CAP1
SWO
11
12
PIO12
PWM0
SCL1
MOSI0
OUT
SWCLK
12
13
PIO4
PWM4
CTS0
MOSI0SSELN1(1)
ISPSEL
13
15(SET)
PIO13
PWM2
SDA1
MOSI0
SWDIO
14
2
PIO10
TXD1
SCL0
SCK0
CT32B0CAP0
15
16
PIO1
PWM1
RXD1
MISO1
16
17
PIO0
PWM0
TXD1
SCK1
17
19
PIO11
RXD1
SDA0
MISO0
CT32B1CAP0
18
18
PIO20
PWM8
TXD1
IO2
ACP
19
20
PIO21
PWM9
IO1
ACM
SWO
20
1,14
GND
21
21(RST)
RSTN
22
24(A)
PIO14
PWM1
ADC0
SSELN1(1)
CT32B0CAP1
SWO
23
22(B)
PIO15
PWM3
ADC1
SCL0
SCK1
OUT
24
23(C)
PIO16
PWM5
ADC2
SDA0
SSELN1(0)
CSN
25
25(D)
PIO17
PWM6
ADC3
MOSI1
IO3
SWO
26
26(E)
PIO18
PWM7
ADC4
TXD0
MISO1
CLK
CT32B0MAT1
27
27
PIO19
PWM4
ADC5
RXD0RXD1
IO0
28
1,14(GND)
GND
29
N/A(ANT R)
LA
30
1,14GND
GND
31
N/A(ANT L)
LB
32
1,14GND
GND
※1. Pin numbers. The number and assignment of pin numbers differ between TWELITE and TWELITE DIP. Normally, IO names are used to identify pins.
※2. IO names of the pins. These names are used in semiconductor datasheets and TWELITE application development. Our technical support also refers to pins by IO names in principle.
※3. This table lists representative functions. Only a portion of these functions may be supported by the TWENET library.
For compatibility with the TWELITE BLUE/RED series, the following pins are internally connected:
PIO0: SMD#1 and SMD#16
PIO14: SMD#10 and SMD#22
Since ADC pins are shared with PIO pins, internal pull-ups must be disabled to read analog voltage values.
It is recommended to connect all GND pins SMD#28, 30, and 32. However, operation without connecting them is also possible.
Even when these pins are left unconnected, no significant change in wireless performance has been observed.
Electrical Characteristics
ALL
Absolute Maximum Ratings
Min
Max
Power Supply
-0.3
3.96
V
Reset
-0.3
3.96
V
Digital IO
-0.3
3.96
V
ADC
-0.3
3.96
V
NFC (LA/LB)
-0.3
4.6
V
The values are based on the semiconductor datasheet.
Recommended Operating Conditions
Symbol
Condition
Min
Max
Supply Voltage
VCC
1.9
3.6
V
Operating Temp
TJ
No condensationMW-G-W
-40
105
°C
No condensationMW-G-U
-40
90
°C
The values are based on the semiconductor datasheet.
DC Characteristics
Symbol
Condition
Min
Typ
Max
Current Consump.
ICC
Sleep, SRAM not retained, no timer
350
nA
Sleep, SRAM not retained, timer enabled
800
nA
Sleep, SRAM retained (4KB), timer enabled
1025
nA
Sleep, SRAM retained (8KB), timer enabled
1120
nA
Active, TX (10dBm)
20.28
mA
Active, TX (3dBm)
9.44
mA
Active, TX (0dBm)
7.36
mA
Active, RX
4.3
mA
The values are based on the semiconductor datasheet.
I/O Characteristics
Symbol
Condition
Min
Typ
Max
PIO Internal Pull-up
Rpu(int)(PIO)
40
50
60
kΩ
RSTN Internal Pull-up
Rpu(int)(RSTN)
40
50
60
kΩ
PIO Internal Pull-down
Rpdn(int)(PIO)
40
50
60
kΩ
IO High Input
VIH
0.7*VCC
VCC
V
IO Low Input
VIL
-0.3
0.27*VCC
V
IO High Output
VOH
PIO0-9,12-162mA load (VCC=3.6V)
3.3
VCC
V
PIO0-9,12-162mA load (VCC=3.0V)
2.65
VCC
V
PIO0-9,12-162mA load (VCC=2.4V)
2
VCC
V
PIO0-9,12-162mA load (VCC=1.9V)
1.4
VCC
V
PIO17-215mA load (VCC=3.6V)
3.2
VCC
V
PIO17-215mA load (VCC=3.0V)
2.6
VCC
V
PIO17-215mA load (VCC=2.4V)
2.05
VCC
V
PIO17-215mA load (VCC=1.9V)
1.35
VCC
V
PIO10,112mA load (VCC=3.6V)
3.3
VCC
V
PIO10,112mA load (VCC=3.0V)
2.66
VCC
V
PIO10,112mA load (VCC=2.4V)
2.1
VCC
V
PIO10,112mA load (VCC=1.9V)
1.15
VCC
V
IO Low Output
VOL
0
0.4
V
The values are based on the semiconductor datasheet.
ADC Characteristics
Symbol
Condition
Min
Typ
Max
Input Voltage
Vi
0
VCC
V
Full Scale Range
FSR
After calibration
3.56
3.6
3.62
V
Resolution
12
bits
Current Consumption
IADCx
x=05
100
uA
Integral Nonlinearity
INL
1.1
LSB
Differential Nonlinearity
DNL
0.85
LSB
Offset Error
EO
After calibration
-4.5
4.5
mV
Gain Error
EG
After calibration
-40
0
20
mV
Sampling Frequency
fs
Single channel
78.4
100
190
ksps
The values are based on the semiconductor datasheet.
Mechanical Characteristics
External Dimensions
SMD
Outline Drawing
Dimensions: 13.97mm x 13.97mm x 2.5mm
Weight: 0.84g (MW-G-W), 0.86g (MW-G-U)
DXF data for the external shape of the TWELITE BLUE / RED / GOLD Series (SMD) can be downloaded from our website.
DIP
Outline Drawing (Board Antenna)
Outline Drawing (U.FL)
Dimensions: 44.7mm x 18.3mm x 8.1mm
Weight: 3.81g (MW-G-DIP-P), 3.83g (MW-G-DIP-U)
Recommended Pad Dimensions
SMD
Do not place silkscreen or through-holes on the receiving PCB area that contacts the module underside.
When connecting a wire antenna such as a stick antenna, provide a slot on the receiving PCB and solder from the underside of the module. (See Antenna Opening)
Use a metal mask thickness in the range of t = 0.12–0.15mm. Due to the metal mask and reflow conditions, solder fillets may not form on some half-cut vias on one side of the module.
Environmental Regulations
Compliant with RoHS (10 substances)
Shield Can
The shield can is soldered at two diagonal points.
A thin solder plating may be spread over the top of the shield can. This does not affect functionality.
Antenna Opening
SMD
When mounting TWELITE to a custom PCB and using a wire antenna such as a stick antenna, create an opening on the board and solder from the underside.
The figure below shows an example opening.
In this example, pins 29, 30, 31, and 32 (LA, GND, LB, GND) are left unconnected to allow for a wider opening.
Reflow Conditions
SMD
Soldering should, in principle, be performed using reflow soldering.
Recommended Reflow Profile
Reflow Profile
Preheating
Main Heating
Peak Temp
Reflow Count
150180°C/6090sec
220°C/30-45sec
245°C
1
We have confirmed through evaluation that there are no issues with the above profile, but please verify it under your own mounting conditions.
Ordering Information
Product Codes
ALL
Product Name
Product Code
Sales Type
Packaging
MOQ
SPQ
TWELITE
MW-G-W
Retail
Individual Pack
1
1
MW-G-W-BULK
Wholesale
Cut Tape/Tray
100
100
MW-G-W-REEL
Wholesale
Reel
1000
1000
MW-G-U
Retail
Individual Pack
1
1
MW-G-U-BULK
Wholesale
Cut Tape/Tray
100
100
MW-G-U-REEL
Wholesale
Reel
1000
1000
TWELITE DIP
MW-G-DIP-P
Retail
Individual Pack
1
1
MW-G-DIP-P-BULK
Wholesale
Tray
100
100
MW-G-DIP-U
Retail
Individual Pack
1
1
MW-G-DIP-U-BULK
Wholesale
Tray
100
100
Product codes are subject to change. For the latest codes, please refer to our website.
Packaging
SMD
Taping Dimensions
Reel Dimensions
Precautions
Mounting Precautions
SMD
The product should be reflow soldered only once under our recommended reflow conditions. Please note that solder inside the product will re-melt during reflow.
This product absorbs moisture when left in a natural environment. Please perform reflow mounting within 72 hours after opening.
If more than 72 hours have passed after opening, perform baking under the following conditions before use:
Baking in reels is not allowed; transfer to trays, etc., before baking.
Bake at 90°C for 48 hours, up to one time only.
Please note that multiple LOT numbers may be mixed in a single package.
Solder fillets on soldered parts of components mounted inside the product are not required.
This product is intended for mounting on glass epoxy substrates. If mounting on substrates made of materials other than glass epoxy (e.g., ceramics), please conduct thorough evaluation before use.
Due to the nature of components mounted inside the product, they are highly sensitive to static electricity. Ensure full ESD protection when handling.
If stress is applied to the shield case, it may come off. Please handle with care.
For hand soldering, please follow these conditions: temperature below 350°C, within 3 seconds (package surface temperature should be below 150°C).
Export Regulations
ALL
TWELITE is equipped with an AES encryption circuit, and we judge it as a product subject to export control classification. If you require a parameter sheet for export classification, please contact us.
In overseas markets, radio certification may be required. Please consult us at an early stage.
Product Markings
ALL
Product logos, certification numbers, and other markings printed on the product may change without notice.
Factory Firmware
ALL
Writing of TWELITE firmware is performed as part of product inspection during manufacturing (to confirm that information such as serial number and MAC address written to the chip is valid). We cannot guarantee information such as firmware version even upon customer request. The presence or type of firmware written to TWELITE STICK at the time of factory shipment may change without notice. We do not rewrite firmware on shipped products. Please use the TWELITE STAGE App or the Python tweliter module.
Storage Precautions
ALL
Store between 0°C and 40°C, avoiding high temperature and humidity.
SMD
Use the product within 6 months after delivery.
Usage Precautions
ALL
When using the product, always conduct evaluations and confirmations in the actual environment. For applications requiring very high reliability or those involving human life, please contact your distributor in advance.
Revision History
Version
Revision Date
Details of Changes
1.0.0
2025-06-04
First Edition
1.0.0rc2
2024-07-16
Pre-release Version
Arm® and Cortex® are registered trademarks of Arm Limited.
NXP® and NTAG® are registered trademarks of NXP B.V.
2.2 - TWELITE (GOLD Series)
Pre-release version
Introduction
TWELITE® is a compact, low-power, high-performance wireless module.
Equipped with an Arm® Cortex®-M4 core, it supports medium-range wireless communication compliant with IEEE802.15.4 and short-range communication compliant with ISO/IEC 14443.
Certified for radio use in Japan, it enables rapid product development for wireless systems.
Features
Ultra-compact body package (13.97mm × 13.97mm × 2.5mm)
Medium-range wireless communication compliant with the global standard IEEE802.15.4
PCB design that maximizes chip performance and ensures stable communication over long distances
Short-range wireless communication with NFC readers compliant with ISO/IEC 14443
Widely used Arm Cortex-M4 architecture
Excellent power-saving performance with standby current as low as 350nA, contributing to longer battery life
Equipped with 152KB SRAM and 640KB flash memory to support advanced communication application software
Six-channel 12-bit ADC and 22 general-purpose digital I/O ports to connect various sensors
Ten channels of PWM output usable for LEDs and actuators
Newly added 32-bit real-time clock
Firmware development environment based on the freely available GNU Arm Embedded Toolchain
Strong AES encryption: 128bit / 192bit / 256bit
Certified under Japan’s ARIB STD-T66 construction design certification (technical conformity)
Some of the semiconductor functions listed above may not be supported in TWELITE NET.
Product Variants
The TWELITE Wireless Module (GOLD Series) comes in the following variations. Please select according to your application.
Product Name
Model No.
Antenna Terminal
Remarks
TWELITE
MW-G-W
Wire antenna terminal(through-hole)
Antenna sold separately
MW-G-U
Coaxial antenna terminal(U.FL/IPEX)
Antenna sold separately
TWELITE DIP
MW-G-DIP-P
PCB antenna
MW-G-DIP-U
Coaxial antenna terminal(U.FL/IPEX)
Antenna sold separatelyMain body: MW-G-W
MW-G-W Appearance
MW-G-U Appearance
MW-G-DIP-P Appearance
MW-G-DIP-U Appearance
In the following documentation, references related to MW-G-W/U are marked as
SMD
, those related to MW-G-DIP-P/U as
DIP
, and those applicable to all as
ALL
.
Functions
ALL
32-bit Arm Cortex-M4 processor
Operating clock: 32MHz (variable between 12MHz and 48MHz to optimize power consumption)
SRAM: 152KB
Flash memory: 640KB
EEPROM: 2KB (mounted on internal NFC chip)
Watchdog timer, brown-out detection
Power control for each block (Digital/Analog/SRAM/Wireless)
AES encryption circuit: 128bit / 192bit / 256bit
6x ADC (12-bit)
10x PWM
2x Timer (32-bit)
1x Comparator
2x UART
2x SPI (with 3 chip selects)
2x I2C
22x Digital IO
1x Quad SPI
1x RTC (32-bit)
Since many I/O pins are multiplexed, some combinations may not be usable simultaneously.
A board antenna that can be mounted on the PCB (MW-A-P1934) is also available. See Board antenna (MW-A-P1934).
If you use an antenna not certified for TWELITE, new radio certification must be obtained.
Certification
ALL
TWELITE (GOLD Series)
Certification Model Name
TWELITE GOLD
Technical Conformity ID
007-AL0022
FCC ID
TBA
IC ID
TBA
When using TWELITE overseas, please note that restrictions may apply to the type of antennas and other conditions.
Please consult us during the early stage of your development.
Depending on the country or region, it may be required to display FCC ID or IC ID on the TWELITE module or the product.
If unsure, please contact us for confirmation.
NFC Tag
ALL
Item
TWELITE (GOLD Series)
Remarks
Communication
ISO/IEC 14443 Type A
Protocol
NFC Forum Type 2 Tag
NXP® NTAG®
Data Rate
106kbps
SRAM
64 bytes
EEPROM
2KB
Write Time
4.8ms
4 bytes, EEPROM
0.8ms
4 bytes, SRAM
6.1ms
64 bytes, SRAM (FAST_WRITE)
Max Range
100mm
Depends on antenna, etc.
Development Environment
ALL
TWELITE STAGE SDK
TWELITE STAGE SDK is a dedicated firmware development environment for the TWELITE series provided by our company. By using the included TWELITE STAGE APP, you can build, write firmware, verify operation, and configure settings.
For usage instructions, please refer to the documentation included with the TWELITE STAGE SDK.
Materials on the website may reflect newer versions of the TWELITE STAGE SDK or applications, which may differ from the specifications of the version you are using.
The TWELITE STAGE SDK includes the following components:
TWELITE STAGE APP (frontend for build operations; executes builds via make using the command-line tool and writes firmware)
Located in MWSTAGE/, excluding MWSDK (note 1) and Tools.
Toolchain (compiler and other command-line utilities)
Located under the MWSTAGE/Tools folder.
MWSDK Libraries (used during builds)
Located under MWSTAGE/MWSDK (note 1)
Note 1: In addition to the latest version, older library versions may also be included in the MWSDK folder. These are placed in folders named by version, such as MWSDK20XX_YY.
The binaries generated during the build are directly affected by the version of the gcc toolchain and the MWSDK library.
Distribution of TWELITE STAGE SDK
The TWELITE STAGE SDK for TWELITE GOLD is distributed by our support team.
Below are the currently distributed versions:
MWSTAGE2024_07G (Distributed in July 2024)
STAGE App: 2.4.1
Toolchain: gcc 12.2.1 20221205
MWSDK Library: MWSDK2024_07G
Development Information Specific to TWELITE GOLD
Details on build methods and APIs are documented in .../MWSDK/TWENET/current/index.html under the MWSDK folder.
About MCUXpresso
MCUXpresso is a firmware development environment provided by NXP Semiconductors N.V., the manufacturer of the JN5189 semiconductor mounted on the TWELITE (GOLD Series). In addition to build and write capabilities, it also supports debugging using MCU-Link.
We do not provide support for tools offered by semiconductor manufacturers.
Software License Agreement
For software provided by MONO WIRELESS Inc., please refer to the license descriptions in the LICENSE folder under the MWSDK library within the TWELITE STAGE SDK when developing firmware. Although English versions are available, in the event of conflicting interpretations, the Japanese version shall take precedence.
MW-SLA-1E1, MW-OSSLA-1E・・・ English versions of the above
Please check the license description in the source code to understand which license applies.
Source code created by MONO WIRELESS Inc. is generally licensed under MW-SLA or MW-OSSLA.
For licenses related to tools, refer to the distribution directory of the TWELITE STAGE SDK.
The license for the TWELITE STAGE APP is located under MWSTAGE/TWELITE_Stage/LICENSE.
Pin Assignment
Pin Number
SMD
Pin Number Assignment
DIP
Pin Number Assignment (DIP)
Functions of Each Pin
ALL
The representative functions are shown in the table below.
Name
Function
PIO
Peripheral input/output
PWM
Pulse-width modulation output
TXD
UART Data Transmission
RXD
UART Data Reception
RTS
UART Request to Send (output)
CTS
UART Clear to Send (input)
SCL
I2C Serial Clock
SDA
I2C Serial Data
SCK
SPI Serial Clock
MOSI
SPI Controller Output (PICO)
MISO
SPI Controller Input (POCI)
SSELN
SPI Peripheral Select (CS)
Name
Function
IO
Quad SPI Serial Data
CSN
Quad SPI Chip Select
CLK
Quad SPI Serial Clock
MAT
Timer Output
CAP
Timer Input
OUT
Comparator Output
ACP
Comparator + Input
ACM
Comparator - Input
SWDIO
SWD Serial Data
SWO
SWD Trace Port
SWCLK
SWD Serial Clock
ISPENT
ISP Entry
ISPSEL
ISP Mode Select
The typical function assignments are shown in the following table.
SMD#Note 1
DIP# (14P)Note 1
IONote 2
PWMNote 3
ADCNote 3
UARTNote 3
I2CNote 3
SPINote 3
QuadSPINote 3
Timer(CT32)Note 3
ComparatorNote 3
SWDISPNote 3
1
6
PIO0
PWM0
TXD1
SCK1
2
7(PRG)
PIO5
RTS0
SSELN0MISO1SSELN1(2)
ISPENT
3
5
PIO2
PWM2
RXD0
SCK0MOSI1
4
8
PIO3
PWM3
TXD0
MISO0SSELN1(0)
5
28(VCC)
VCC
6
9
PIO7
PWM7
CTS0RXD1
SDA1
MISO0
CT32B1MAT1
7
4
PIO6
PWM6
RTS0TXD1
SCL1
SCK0
CT32B1MAT0
8
10(TXD)
PIO8
PWM8
TXD0
MOSI0
CT32B0MAT0
OUT
9
3(RXD)
PIO9
PWM9
RXD0
SSELN0
CT32B1CAP1
10
11(A)
PIO14
PWM1
ADC0
SSELN1(1)
CT32B0CAP1
SWO
11
12
PIO12
PWM0
SCL1
MOSI0
OUT
SWCLK
12
13
PIO4
PWM4
CTS0
MOSI0SSELN1(1)
ISPSEL
13
15(SET)
PIO13
PWM2
SDA1
MOSI0
SWDIO
14
2
PIO10
TXD1
SCL0
SCK0
CT32B0CAP0
15
16
PIO1
PWM1
RXD1
MISO1
16
17
PIO0
PWM0
TXD1
SCK1
17
19
PIO11
RXD1
SDA0
MISO0
CT32B1CAP0
18
18
PIO20
PWM8
TXD1
IO2
ACP
19
20
PIO21
PWM9
IO1
ACM
SWO
20
1,14
GND
21
21(RST)
RSTN
22
24(A)
PIO14
PWM1
ADC0
SSELN1(1)
CT32B0CAP1
SWO
23
22(B)
PIO15
PWM3
ADC1
SCL0
SCK1
OUT
24
23(C)
PIO16
PWM5
ADC2
SDA0
SSELN1(0)
CSN
25
25(D)
PIO17
PWM6
ADC3
MOSI1
IO3
SWO
26
26(E)
PIO18
PWM7
ADC4
TXD0
MISO1
CLK
CT32B0MAT1
27
27
PIO19
PWM4
ADC5
RXD0RXD1
IO0
28
1,14(GND)
GND
29
N/A(ANT R)
LA
30
1,14GND
GND
31
N/A(ANT L)
LB
32
1,14GND
GND
Note 1. These are the pin numbers. TWELITE and TWELITE DIP have different counts and assignments. IO names are generally used to identify pins.
Note 2. IO names of the pins. These names are used in semiconductor datasheets and TWELITE application development. Our technical support also refers to pins by IO names in principle.
Note 3. This table lists representative functions. Only a subset is supported in the TWENET library.
To maintain compatibility with TWELITE BLUE/RED series, the following pins are internally connected:
PIO0: SMD#1 and SMD#16
PIO14: SMD#10 and SMD#22
Since ADC pins share PIO pins, internal pull-up must be disabled to read analog voltages.
It is recommended to connect all GND pins: SMD#28, 30, and 32.
Even if these pins are left unconnected, no significant changes in wireless performance have been observed.
Electrical Characteristics
ALL
Absolute Maximum Ratings
Min
Max
Power Supply
-0.3
3.96
V
Reset
-0.3
3.96
V
Digital I/O
-0.3
3.96
V
ADC
-0.3
3.96
V
NFC (LA/LB)
-0.3
4.6
V
Values are based on the semiconductor datasheet.
Recommended Operating Conditions
Symbol
Condition
Min
Max
Supply Voltage
VCC
1.9
3.6
V
Operating Temp
TJ
No condensationMW-G-W
-40
105
°C
No condensationMW-G-U
-40
90
°C
Values are based on the semiconductor datasheet.
DC Characteristics
Symbol
Condition
Min
Typ
Max
Current Cons.
ICC
Sleep, SRAM not retained, no timer
350
nA
Sleep, SRAM not retained, with timer
800
nA
Sleep, 4KB SRAM retained, with timer
1025
nA
Sleep, 8KB SRAM retained, with timer
1120
nA
Active, TX (10dBm)
20.28
mA
Active, TX (3dBm)
9.44
mA
Active, TX (0dBm)
7.36
mA
Active, RX
4.3
mA
Values are based on the semiconductor datasheet.
I/O Characteristics
Symbol
Condition
Min
Typ
Max
PIO Pull-up Resistor
Rpu(int)(PIO)
40
50
60
kΩ
RSTN Pull-up Resistor
Rpu(int)(RSTN)
40
50
60
kΩ
PIO Pull-down Resistor
Rpdn(int)(PIO)
40
50
60
kΩ
IO Input High
VIH
0.7 * VCC
VCC
V
IO Input Low
VIL
-0.3
0.27 * VCC
V
IO Output High
VOH
PIO0-9,12-16, 2mA load (VCC=3.6V)
3.3
VCC
V
PIO0-9,12-16, 2mA load (VCC=3.0V)
2.65
VCC
V
PIO0-9,12-16, 2mA load (VCC=2.4V)
2.0
VCC
V
PIO0-9,12-16, 2mA load (VCC=1.9V)
1.4
VCC
V
PIO17-21, 5mA load (VCC=3.6V)
3.2
VCC
V
PIO17-21, 5mA load (VCC=3.0V)
2.6
VCC
V
PIO17-21, 5mA load (VCC=2.4V)
2.05
VCC
V
PIO17-21, 5mA load (VCC=1.9V)
1.35
VCC
V
PIO10,11, 2mA load (VCC=3.6V)
3.3
VCC
V
PIO10,11, 2mA load (VCC=3.0V)
2.66
VCC
V
PIO10,11, 2mA load (VCC=2.4V)
2.1
VCC
V
PIO10,11, 2mA load (VCC=1.9V)
1.15
VCC
V
IO Output Low
VOL
0
0.4
V
Values are based on the semiconductor datasheet.
ADC Characteristics
Symbol
Condition
Min
Typ
Max
Input Voltage
Vi
0
VCC
V
Full Scale Range
FSR
After calibration
3.56
3.6
3.62
V
Resolution
12
bits
Current Consumption
IADCx
x=05
100
µA
Integral Non-linearity
INL
1.1
LSB
Differential Non-linearity
DNL
0.85
LSB
Offset Error
EO
After calibration
-4.5
4.5
mV
Gain Error
EG
After calibration
-40
0
20
mV
Sampling Frequency
fs
Single channel
78.4
100
190
ksps
Values are based on the semiconductor datasheet.
Mechanical Characteristics
External Dimensions
SMD
Outline Drawing
Dimensions: 13.97mm x 13.97 mm x 2.5mm
Weight: 0.84g (MW-G-W), 0.86g (MW-G-U)
DXF data for the TWELITE BLUE / RED / GOLD series (SMD) external shapes can be downloaded from our website.
DIP
Outline Drawing (PCB Antenna)
Outline Drawing (U.FL)
Dimensions: 44.7mm x 18.3 mm x 8.1mm
Weight: 3.81g (MW-G-DIP-P), 3.83g (MW-G-DIP-U)
Recommended Pad Dimensions
SMD
Do not place silk screen or through-holes on the receiving PCB area that contacts the back of the module.
When connecting wire antennas such as matchstick antennas, create a rectangular hole in the receiving PCB and solder from the back side. (See Antenna Mounting Opening)
Use a metal mask thickness in the range of t = 0.12 to 0.15mm. Depending on the metal mask and reflow conditions, solder fillets may not form on some half-holes of the module.
Environmental Regulations
RoHS (10 substances) compliance is planned (note: under analysis).
Shield Can
The shield can is soldered at two diagonal points.
The shield can may have a thin solder plating on the top surface. This does not affect functionality. Please be aware in advance.
Antenna Mounting Opening
SMD
To connect a matchstick or similar wire antenna when mounting TWELITE on a custom board, create an opening on the board and solder from the back side.
The following figure is one example of such an opening.
In this example, pins 29, 30, 31, 32 (LA, GND, LB, GND) are left unconnected to allow for a larger opening.
Reflow Conditions
SMD
Reflow soldering is the recommended method for mounting.
Recommended Reflow Profile
Reflow Profile
Preheating
Main Heating
Peak Temp
Reflow Count
150180°C/6090sec
220°C/30-45sec
245°C
1
We have confirmed through our mounting evaluation that the above profile poses no issues, but please verify under your actual mounting conditions.
Ordering Information
Sales Code
ALL
Product Name
Sales Code
Sales Type
Packaging
MOQ
SPQ
TWELITE
MW-G-W
Retail
Individual Pack
1
1
MW-G-W-BULK
Wholesale
Cut Tape / Tray
100
100
MW-G-W-REEL
Wholesale
Reel
1000
1000
MW-G-U
Retail
Individual Pack
1
1
MW-G-U-BULK
Wholesale
Cut Tape / Tray
100
100
MW-G-U-REEL
Wholesale
Reel
1000
1000
TWELITE DIP
MW-G-DIP-P
Retail
Individual Pack
1
1
MW-G-DIP-P-BULK
Wholesale
Tray
100
100
MW-G-DIP-U
Retail
Individual Pack
1
1
MW-G-DIP-U-BULK
Wholesale
Tray
100
100
Sales codes are subject to change. Please refer to our website for the latest information.
Packaging
SMD
Taping Dimensions
Reel Dimensions
Notes
Mounting Precautions
SMD
The recommended number of reflows is one. During reflow, internal solder may re-melt; handle with care.
This product is moisture-sensitive. Please perform reflow within 72 hours after opening.
Use proper anti-static precautions.
If 72 hours have passed after opening, perform a baking process under the following conditions before use:
Do not bake in the reel. Transfer to a tray or similar.
Bake at 90°C for 48 hours, only once.
Multiple LOT numbers may be mixed in one package.
Presence or absence of solder fillets on mounted parts is not guaranteed.
Designed for mounting on FR-4 (glass epoxy). If using a different substrate (e.g., ceramic), evaluate thoroughly beforehand.
Components mounted inside the product are highly sensitive to static electricity. Ensure sufficient static protection.
The shield case may come off under stress. Please handle with care.
For hand soldering, follow these conditions: ≤350°C, ≤3 seconds (≤150°C on package surface).
Export Control
ALL
The AES encryption circuit in TWELITE falls under controlled goods. Contact us for the parameter sheet.
Depending on the destination, radio certification may be required for customs clearance. Contact us regarding country-specific regulations.
Product Marking
ALL
Product logos and certification numbers printed on the product may change without notice.
Factory Default Firmware
ALL
TWELITE (MW-G-W/U, MW-G-DIP-P/U) is shipped with the “Extremely Simple! Standard App (App_Twelite)” pre-installed (at the time of this datasheet’s creation). This app is written during manufacturing to verify chip configuration (e.g., serial number and MAC address), and firmware version information will not be disclosed upon request.
Please note that the presence or type of pre-installed firmware may change without notice. Always write the necessary firmware in your own manufacturing process. We do not provide reflashing services for shipped products.
Storage Precautions
ALL
Store at temperatures between 0°C and 40°C, avoiding high temperature and humidity.
SMD
Use the product within 6 months of delivery.
Usage Notes
ALL
Always evaluate and verify in your actual usage environment. For high-reliability or life-critical applications, consult your distributor beforehand.
Revision History
Version
Date
Description
1.0.0rc2
2024-07-16
Initial version released
Arm® and Cortex® are registered trademarks of Arm Limited.
NXP® and NTAG® are registered trademarks of NXP B.V.