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As of 2025-07-24

TWELITE

Wireless Microcontroller Module

TWELITE is a microcontroller module with wireless functionality.

By mounting it on a parent board connected to sensors, switches, LEDs, etc., you can build compact wireless devices.

It consumes very little power and can operate for long periods on batteries.

It is suitable for mass production due to its surface-mount compatibility with automated assembly machines.

1 - TWELITE BLUE / RED Wireless Microcontroller

Model: TWE-L-(WX/U) / MW-R-(WX/U)
TWELITE BLUE / RED is the first generation of the TWELITE series.

1.1 - TWELITE Wireless Microcontroller Datasheet

Latest Edition
TWELITE BLUE (Certification Model: TWE-001 Lite) and TWELITE RED (Certification Model: TWELITE RED) are compact modules integrating an ultra-low-power, high-performance microcontroller, flash memory, and a high-performance wireless interface compliant with IEEE802.15.4. The modules operate by connecting power and sensors, and storing programs in the flash memory or EEPROM. They support SPI, I2C, and UART interfaces, enabling connection to various sensors or microcontrollers. Certified for use in Japan, these modules can be incorporated into products immediately.

Features

  • Compliant with the global IEEE802.15.4 standard
  • Supports our proprietary protocol stack “TWELITE NET”
  • Ultra-compact module (13.97 × 13.97 × 2.5 mm)
  • PCB design maximizes chip performance for stable long-range communication
  • Equipped with 32KB RAM and 160KB/512KB flash memory, enabling high-performance communication applications
  • Extremely low standby current of 0.1μA (RAMOFF sleep), extending battery life
  • Rich I/O including 4 or 6 ADCs, 1 comparator, and 20 general-purpose I/O ports for direct sensor connection
  • On-board flash memory allows firmware updates
  • Firmware development supported by free GNU and Eclipse-based environments
  • Robust 128-bit AES encryption ensures security
  • Certified under Japan’s ARIB STD-T66 (Technical Conformity), usable without additional license or application
  • RoHS compliant, meeting new environmental standards

Specifications

Product Variants

TWELITE BLUE and TWELITE RED are available in the variations shown below. Please select the most suitable model for your application.

Sales codes may change over time. Please refer to our website for the latest sales codes.

Common NameSales CodeAntenna TerminalNotes
TWELITE BLUETWE-L-WXWire antenna terminal typeAntenna not included (reel only)
TWE-L-UCoaxial antenna typeAntenna not included
TWELITE REDMW-R-WXWire antenna terminal typeAntenna not included
MW-R-UCoaxial antenna typeAntenna not included

Wireless Section

TWELITE
BLUE
TWELITE
RED
Notes
Communication Method2.4GHz
IEEE 802.15.4 compliant
2.4GHz
IEEE 802.15.4 compliant
Protocol StackTWELITE NET and
IEEE 802.15.4 MAC
TWELITE NET and
IEEE 802.15.4 MAC
Data RateUp to 250kbpsUp to 250kbps
ModulationO-QPSK, DSSSO-QPSK, DSSS
Number of Channels1616May vary by country
TX Output Power2.5dBm9.19dBm25°C, 3V
RX Sensitivity-95dBm-96dBm25°C, 3V, typ
TX Current15.3mA23.3mA25°C, 3V, typ at max output
14.0mAAt 3dBm output
RX Current17.0mA14.7mA25°C, 3V, typ

Microcontroller Section

  • 32-bit RISC processor
  • Variable clock for power optimization
  • RAM: 32kBytes
  • EEPROM: 4kBytes
  • Flash memory: 160kBytes (TWELITE BLUE) / 512kBytes (TWELITE RED)
  • Watchdog timer, brown-out detection
  • Fine-grained power control for each block (digital/analog/RAM/wireless)
  • Built-in AES 128-bit encryption circuit and 16-bit random number generator

Interfaces

QtyNotes
ADC4/610-bit. 4 ports for TWELITE BLUE, 6 ports for TWELITE RED
PWM4
Timer/PWM15 modes including PWM, Δ∑. 16MHz, 16-bit resolution
Pulse Counter2Operates in sleep mode. Max 100kHz, 16-bit
UART216550A compatible
SPI
Master/Slave
13 chip selects, up to 16MHz
Comparator1
2-wire Serial
Master/Slave
(I2C, SMBUS compatible)
1Up to 100kHz or 400kHz, 7/10-bit address modes
General-purpose Digital20Shared with other interfaces
  • Many pins are shared; some combinations may not be available simultaneously.

Certifications and Compliance

TWELITE BLUETWELITE RED
Certification ModelTWE-001 LiteTWELITE RED
Technical Conformity Number007-AB0031007-AF0062
FCC ID2AINN-L1-
IC ID21544-L1-
NotesRoHS compliantRoHS compliant

※1. When using TWELITE outside Japan, there may be restrictions on antennas and other components. Please consult us at the early stage of your development.

※2. Depending on the country, it may be necessary to display the FCC ID or IC ID on TWELITE or your product. If applicable, please contact us.

Export Precautions

  • The built-in AES 128-bit encryption circuit in TWELITE is subject to export control. We will issue an export control statement as needed; please contact us when exporting.
  • In some countries, customs clearance may not be possible unless TWELITE has obtained local radio certification. Please inquire about regulations for each export destination.

Product Labeling

The product is marked with a logo, certification numbers, etc., which are subject to change without notice.

Block Diagram

Block diagram of the TWELITE series

External Dimensions

External dimensions

Dimensions: 13.97 × 13.97 × 2.5 mm Weight: 0.93 g

DXF data for TWELITE BLUE/TWELITE RED outlines is available for download from our website.

Recommended pad diagram
  • The mating PCB contacting the module’s underside must not have silkscreen or through-holes.
  • When soldering a wire antenna (such as a matchstick antenna), provide a rectangular hole in the mating PCB and solder from the underside of the module. (See Chapter 7 for details.)
  • Use a metal mask thickness in the range of t=0.12–0.15mm. Depending on the mask and reflow conditions, solder fillets may not form on one side of the module’s half-through-holes.

Antenna Mounting Opening

Antenna mounting opening diagram

When mounting TWELITE on your custom PCB, it is efficient to provide an opening for connecting a wire antenna (matchstick antenna) and solder from the underside.

This drawing shows an example of such an opening.

In this example, pins 29, 30, 31, and 32 (NC, GND, GND, GND) are left unconnected to allow for a larger opening.

Note: Connecting GND pins 28, 30–32 on the SMD version is recommended, but operation without connection is also possible. No significant change in wireless performance has been observed even if left unconnected.

Pin Assignment

Pin Numbers

Antenna mounting opening diagram

Pin Assignment

# (Note 1)IO Name (Note 2)Function Assignment (Note 3)Alternate Assignment (Note 4)Super Easy! Standard App Function Name (Note 5)
1DO0SPICLKPWM2(※6)PWM2
2DO1SPIMISOPWM3(※6)PWM3
3DIO18SPIMOSIDO1
4DIO19SPISEL0DO2
5VCCVCCVCC
6DIO4CTS0TIM0OUTPC0DO3
7DIO5RTS0PWM1PC1PWM1
8DIO6TXD0PWM2TX
9DIO7RXD0PWM3RX
10DIO8TIM0CK_GTPC1PWM4PWM4
11DIO9TIM0CAP32KTALINRXD1DO4
12DIO10TIM0OUT32KTALOUTM1
13DIO12PWM2CTS0DI1
14DIO14SIF_CLKTXD1TXD0SPISEL1SCL
15DIO13PWM3RTS0DI2
16DIO11PWM1TXD1DI3
17DIO15SIF_DRXD1RXD0SPISEL2SDA
18DIO16COMP1PSIF_CLkDI4
19DIO17COMP1MPWM4SIF_DBPS
20GNDGND
21RESETNRESETNRST
22ADC2VREFAI3
23ADC1AI1
24DIO0SPISEL1ADC3AI2
25DIO1SPISEL2ADC4PC0AI4
26DIO2ADC5(※7)TIM0CK_GTM2
27DIO3ADC6(※7)TIM0CAPM3
28GNDGNDGND
29NCRFN/A
30GNDGNDGND
31GNDGNDGND
32GNDGNDGND

Note 1. Pin number. Note that the number and assignment may differ from TWELITE DIP. IO name is usually used to identify pins. Note 2. IO name. This is used in semiconductor datasheets, TWELITE app development, and technical support. Note 3. Each pin can be used as simple I/O or analog input, but can also be initialized for other functions via API. The table lists typical functions. Note 4. Alternate functions assignable via API. The table lists typical alternate functions. Note 5. Pin names used by the “Super Easy! Standard App (App_Twelite)”. These are similar to IO names but take care to avoid confusion. Note 6. PWM2,3 can be assigned to DO0,1 by releasing DIO6,7 or DIO12,13 assignments. Note 7. ADC5,6 are available only on TWELITE RED.

Function Reference

Signal NameFunction
PCPulse Counter
SPICLKSPI Master Clock
SPISELSPI Select Output
SPIMISOSPI Master Input
SPIMOSISPI Master Output
TIM0CK_GTTimer Clock, Gate Input
TIM0CAPTimer Capture Input
TIM0OUTTimer PWM Output
32KTALINCrystal Input
32KTALOUTCrystal Output
VREFReference Voltage
COMP1MComparator + Input
COMP1PComparator - Input
SIF_D2-wire Serial Data
SIF_CLK2-wire Serial Clock
RXDUART RX
TXDUART TX
RTSUART RTS
CTSUART CTS
PWMPulse Width Modulation Output

Special Pin Handling

DO0 (Function: SPICLK)

This pin is used as an output. If an external voltage is applied (even with some output impedance), there have been reports that the TWE module may fail to enter programming mode.
When connecting LEDs or transistors, the pin may enter an intermediate state at startup or wakeup from sleep, possibly causing malfunction. Always use an external circuit that pulls up to Vcc.

DO1 (Function: SPIMISO)

This pin is typically used as an output, but at power-on or reset, it behaves as an input. If a low level is detected at this time, the module boots in programming mode. Pay attention to the voltage at startup on this pin.

DIO0 (Function: ADC3), DIO1 (Function: ADC4)

These pins are shared with analog input. In firmware, the internal pull-up must be disabled when reading AD values .

ADC2

ADC2 can be used as a reference voltage input. Software implementation is required. There is no pin for outputting the reference voltage.

GND

Connecting GND pins 28, 30–32 on the SMD version is recommended, but operation without connection is possible. No significant change in wireless performance has been observed even if left unconnected.

Absolute Maximum Ratings

MinMax
Power Supply (VCC)-0.33.6V
Analog IO (VREF/ADC)-0.3VCC+0.3V
Digital IO-0.3VCC+0.3V

Characteristics

SymbolConditionmintypmax
Power Supply VoltageVCC2.03.03.6V
Startup VoltageVboot2.05V
Operating TemperatureTOPRNo condensationTWELITE BLUE-4025105(Note 1)
90(Note 2)
°C
TWELITE RED-302590
Operating HumidityHOPRNo condensation85%RH

*Values are based on semiconductor datasheets.
Note 1: Maximum operating temperature for TWE-L-WX/W0/W7
Note 2: Maximum operating temperature for TWE-L-U

DC Characteristics

SymbolConditionmintypmax
Current ConsumptionICCSleep (RAMOFF, no timer)TWELITE BLUE0.1uA
TWELITE RED0.1uA
Sleep (with timer)TWELITE BLUE1.5uA
TWELITE RED1.5uA
Tx (CPU doze)TWELITE BLUE15.3mA
TWELITE RED23.3mA
TWELITE RED
(at 3dBm output)
14.0mA
Rx (CPU doze)TWELITE BLUE17.0mA
TWELITE RED14.7mA
TX Output PowerPoutTWELITE BLUE+0.52.5dBm
TWELITE RED9.14dBm
RX SensitivityTWELITE BLUE-95dBm
TWELITE RED-96dBm

*Values are based on semiconductor datasheets.

I/O Characteristics

SymbolConditionmintypmax
DIO Internal Pull-up405060
DIO Hi InputVIHVCCx0.7VCCV
DIO Lo InputVIL-0.3VCCx0.27V
DIO Input Hysteresis200310400mV
DIO Hi OutputVOHTWELITE BLUEVCCx0.8VCCV
TWELITE REDVCC-0.4
DIO Lo OutputVOL00.4V
DIO Sink CurrentIOLVCC 2.7–3.6V4mA
VCC 2.2–2.7V3mA
VCC 2.0–2.2V2.5mA

*Values are based on semiconductor datasheets.

ADC Characteristics

SymbolConditionmintypmax
Reference VoltageVREF1.1981.2351.260V
ADC Resolution10Bits
ADC Integral Nonlinearity±1.6, ±1.8LSB
ADC Differential Nonlinearity-0.50.5LSB
ADC Offset Error0–VREF-10mV
0–2VREF-20
ADC Gain ErrorTWELITE BLUE
0–VREF
+10mV
TWELITE BLUE
0–2VREF
+20
TWELITE RED
0–VREF
-10
TWELITE RED
0–2VREF
-20
ADC Clock0.25,0.5, 1.0MHz
ADC Input Range0.04VREF2xVREFV

*Values are based on semiconductor datasheets.

Reel Specifications

Taping Dimensions

Taping dimensions

Reel Dimensions

Reel dimensions

Maximum Module Packaging Quantity

Reel/Inner BoxQuantity/ReelOuter BoxQuantity
1100011000

Reflow Conditions

Recommended Reflow Profile

Reflow profile

Reflow profile

PreheatingMain HeatingPeak TempNumber of Reflows
150180°C/6090sec220°C/30~45sec245°C1 time
  • Temperature conditions: One reflow within the recommended temperature profile above.
  • Soldering should be performed by reflow soldering as a general rule.
  • We have confirmed no issues under the above profile, but please verify solderability under your own manufacturing conditions.

Board Mounting Precautions

  1. Only one reflow process is allowed under our recommended conditions. Note that solder inside the module will re-melt during reflow. Reflow soldering is the principle method.
  2. The product absorbs moisture if left in the natural environment. Mount using reflow within 72 hours after opening.
  3. When storing below the above humidity, ensure proper anti-static measures.
  4. If more than 72 hours have passed after opening, bake under the following conditions before use:
    • Do not bake reels directly. Transfer to trays, etc., before baking.
    • Baking conditions: 90°C, 48 hours, up to 1 time.
  5. Please note that multiple lot numbers may be mixed in the same package.
  6. Solder fillets are not required on the soldered parts of components mounted on this product.
  7. This product is intended for mounting on glass epoxy PCBs. If mounting on other materials (e.g., ceramics), evaluate thoroughly before use.
  8. Some internal components are highly sensitive to static electricity. Take adequate ESD precautions.
  9. If stress is applied to the shield case, it may detach. Handle with care.
  10. For hand soldering, follow these conditions: below 350°C, within 3 seconds (surface temperature must not exceed 150°C).

Precautions for Use

Factory Default Application

At the time of shipment (as of this datasheet’s publication), TWELITE is programmed with the “Super Easy! Standard App” firmware. This firmware is intended for production testing during manufacturing. We cannot disclose information about the firmware version or contents programmed on TWELITE, even upon request. In the future, the presence or type of pre-installed firmware may be changed without notice. Please write the required application to TWELITE during your own manufacturing process.

Storage

Store in a cool, dry place. Use the product within six months of delivery.

General Notes

Always evaluate and verify our products in your actual usage environment.

If you intend to use this product in applications requiring high reliability or involving human life, please consult your distributor in advance.

Revision History

VersionDateRevision Details
4.0.22024/11/12Corrected current unit error
4.0.12024/07/12Applied sales code changes; antenna column removed
4.0.02024/02/27Migrated to new website
3.0.42019/1/31Added “Factory Default Application” section
3.0.32018/11/05Corrected section number error in Chapter 8
3.0.22018/3/7Corrected pin function name error in App table
3.0.12017/9/1Corrected TWELITE RED sleep current value
3.0.02017/8/1Initial version

2 - TWELITE (GOLD Series)

Model: MW-G-(W/U), MW-G-DIP-(P/U)
TWELITE wireless module (GOLD Series) is the second generation of TWELITE.

2.1 - TWELITE (GOLD Series)

Latest Edition

Introduction

TWELITE® is a compact, low-power, and high-performance wireless module.

Equipped with an Arm® Cortex®-M4 core, it supports mid-range wireless communication compliant with IEEE802.15.4 and short-range communication compliant with ISO/IEC 14443.

It has obtained domestic radio certification in Japan, enabling rapid productization of wireless systems.

Features

  • Ultra-compact package (13.97mm × 13.97mm × 2.5mm)
  • Mid-range wireless communication compliant with global standard IEEE802.15.4
  • PCB design that maximizes chip performance and ensures stable communication over long distances
  • Our proprietary simple protocol stack “TWELITE NET”
  • Short-range communication with NFC readers compliant with ISO/IEC 14443
  • Widely used Arm Cortex-M4 architecture
  • Excellent power-saving performance with minimum standby current of 350nA, contributing to battery life
  • Equipped with 152KB SRAM and 640KB flash memory, supporting advanced communication application software
  • 6-channel 12-bit ADC and 22 general-purpose digital I/O ports to connect various sensors
  • 10-channel PWM output, applicable to LEDs and actuators
  • Newly equipped 32-bit real-time clock
  • Firmware development environment based on the free GNU Arm Embedded Toolchain
  • Strong AES encryption with 128bit / 192bit / 256bit
  • Certified under Japan’s ARIB STD-T66 (technical conformity certification)

Product Variants

The TWELITE wireless module (GOLD Series) is available in the following variants. Please select according to your application.

Product NameModel NumberAntenna TerminalRemarks
TWELITEMW-G-WWire antenna terminal
(through-hole)
Antenna sold separately
MW-G-UCoaxial antenna terminal
(U.FL/IPEX)
Antenna sold separately
TWELITE DIPMW-G-DIP-POn-board antenna
MW-G-DIP-UCoaxial antenna terminal
(U.FL/IPEX)
Antenna sold separately
Main unit is MW-G-W

MW-G-W Appearance

MW-G-W Appearance

MW-G-U Appearance

MW-G-U Appearance

MW-G-DIP-P Appearance

MW-G-DIP-P Appearance

MW-G-DIP-U Appearance

MW-G-DIP-U Appearance

In the following document, the tag SMD indicates sections related to MW-G-W/U, DIP for MW-G-DIP-P/U, and ALL for content relevant to all models.

Functions

ALL
  • 32-bit Arm Cortex-M4 processor
  • Operating clock: 32MHz (clock can be adjusted from 12MHz to 48MHz to optimize power consumption)
  • SRAM: 152KB
  • Flash memory: 640KB
  • EEPROM: 2KB (included in the built-in NFC chip)
  • Watchdog timer and brown-out detection
  • Power control for each block (digital/analog/SRAM/wireless)
  • AES encryption circuit supporting 128bit/192bit/256bit
  • 6x ADC (12bit)
  • 10x PWM
  • 2x Timers (32bit)
  • 1x Comparator
  • 2x UART
  • 2x SPI (3 chip selects)
  • 2x I2C
  • 22x Digital IO
  • 1x Quad SPI
  • 1x RTC (32bit)
Block diagram of TWELITE GOLD Series

Block Diagram of TWELITE (GOLD Series)

2.4GHz Wireless

ALL
ItemTWELITE (GOLD Series)Remarks
Communication2.4GHz IEEE 802.15.4
ProtocolTWELITE NET and IEEE 802.15.4 MAC
Data Rate250kbps
ModulationO-QPSK, DSSS
Channels16Varies by country
Max TX Power9.14dBm25°C, 3V, typ
RX Sensitivity-99.7dBm25°C, 3V, typ
Antennas
ALL

For a list of compatible antennas, please refer to our product information.

SMD

A PCB-mountable antenna MW-A-P1934 is also available.

Certifications
ALL
TWELITE (GOLD Series)
Certification ModelTWELITE GOLD
Technical Conformity Certification Number007-AL0022

NFC Tag

ALL
ItemTWELITE (GOLD Series)Remarks
CommunicationISO/IEC 14443 Type A
ProtocolNFC Forum Type 2 TagNXP® NTAG®
Data Rate106kbps
SRAM64bytes
EEPROM2KB
Write Speed4.8ms4bytes, EEPROM
0.8ms4bytes, SRAM
6.1ms64bytes, SRAM (FAST_WRITE)
Max Distance100mmDepends on antenna configuration

Development Environment

ALL

TWELITE STAGE SDK

TWELITE STAGE SDK is a dedicated firmware development environment for the TWELITE series provided by our company. Using the included application TWELITE STAGE APP, you can build and write firmware, as well as check the operation and change settings of existing firmware.

The TWELITE STAGE SDK consists of the following:

  • TWELITE STAGE APP (frontend for building, which uses command-line make for compilation and performs firmware writing): all except MWSDK (Note 1) and Tools under MWSTAGE/

  • Toolchain (utilities and command-line tools such as compiler): under MWSTAGE/Tools

  • MWSDK library (libraries used in builds): under MWSTAGE/MWSDK (Note 1)

Distribution of TWELITE STAGE SDK

The TWELITE STAGE SDK for TWELITE GOLD is distributed through our support service.

Below are the major versions currently available:

  • MWSTAGE2024_07G distributed in July 2024
    • STAGE App: 2.4.1
    • Toolchain: gcc 12.2.1 20221205
    • MWSDK Library: MWSDK2024_07G

TWELITE GOLD-Specific Development Information

The .../MWSDK/TWENET/current/index.html file under the MWSDK folder contains descriptions about build methods and APIs.

About MCUXpresso

MCUXpresso is a firmware development environment provided by NXP Semiconductors N.V., the manufacturer of the JN5189 semiconductor used in TWELITE (GOLD Series). It allows not only building and writing firmware but also debugging using MCU-Link.

About Software Licensing

When developing firmware using the TWELITE STAGE SDK provided by Mono Wireless Inc., please refer to the license descriptions in the LICENSE folder under the MWSDK library as the primary source. English versions of the licenses are available, but in the event of any dispute or discrepancy, the Japanese version shall take precedence.

  • MW-SLA-1J — Mono Wireless Software License Agreement (intended for commercial use)
  • MW-OSSLA-1J — Mono Wireless Open Source Software License Agreement (considering non-commercial use)
  • MW-SLA-1E1, MW-OSSLA-1E — English versions of the above

Pin Assignment

Pin Number

SMD
Pin Number Assignment

Pin Number Assignment

DIP
Pin Number Assignment (DIP)

Pin Number Assignment (DIP)

Pin Functions

ALL

The typical functions are shown in the table below.

NameFunction
PIOPeripheral Input/Output
PWMPulse Width Modulation Output
TXDUART Data Transmission
RXDUART Data Reception
RTSUART Data Transmission Request Output
CTSUART Data Transmission Request Input
SCLI2C Serial Clock
SDAI2C Serial Data
SCKSPI Serial Clock
MOSISPI Controller Output (PICO)
MISOSPI Controller Input (POCI)
SSELNSPI Peripheral Select (CS)
NameFunction
IOQuad SPI Serial Data
CSNQuad SPI Chip Select
CLKQuad SPI Serial Clock
MATTimer Output
CAPTimer Input
OUTComparator Output
ACPComparator + Input
ACMComparator - Input
SWDIOSWD Serial Data
SWOSWD Trace Port
SWCLKSWD Serial Clock
ISPENTISP Entry
ISPSELISP Mode Select

The typical assignments of functions are shown in the table below.

SMD#
Note1
DIP# (14P)
Note1
IO
Note2
PWM
Note3
ADC
Note3
UART
Note3
I2C
Note3
SPI
Note3
Quad
SPI
Note3
Timer
(CT32)
Note3
Comparator
Note3
SWD
ISP
Note3
16PIO0PWM0TXD1SCK1
27
(PRG)
PIO5RTS0SSELN0
MISO1
SSELN1(2)
ISPENT
35PIO2PWM2RXD0SCK0
MOSI1
48PIO3PWM3TXD0MISO0
SSELN1(0)
528
(VCC)
VCC
69PIO7PWM7CTS0
RXD1
SDA1MISO0CT32B1
MAT1
74PIO6PWM6RTS0
TXD1
SCL1SCK0CT32B1
MAT0
810
(TXD)
PIO8PWM8TXD0MOSI0CT32B0
MAT0
OUT
93
(RXD)
PIO9PWM9RXD0SSELN0CT32B1
CAP1
1011
(A)
PIO14PWM1ADC0SSELN1(1)CT32B0
CAP1
SWO
1112PIO12PWM0SCL1MOSI0OUTSWCLK
1213PIO4PWM4CTS0MOSI0
SSELN1(1)
ISPSEL
1315
(SET)
PIO13PWM2SDA1MOSI0SWDIO
142PIO10TXD1SCL0SCK0CT32B0
CAP0
1516PIO1PWM1RXD1MISO1
1617PIO0PWM0TXD1SCK1
1719PIO11RXD1SDA0MISO0CT32B1
CAP0
1818PIO20PWM8TXD1IO2ACP
1920PIO21PWM9IO1ACMSWO
201,14GND
2121
(RST)
RSTN
2224
(A)
PIO14PWM1ADC0SSELN1(1)CT32B0
CAP1
SWO
2322
(B)
PIO15PWM3ADC1SCL0SCK1OUT
2423
(C)
PIO16PWM5ADC2SDA0SSELN1(0)CSN
2525
(D)
PIO17PWM6ADC3MOSI1IO3SWO
2626
(E)
PIO18PWM7ADC4TXD0MISO1CLKCT32B0
MAT1
2727PIO19PWM4ADC5RXD0
RXD1
IO0
281,14
(GND)
GND
29N/A
(ANT R)
LA
301,14
GND
GND
31N/A
(ANT L)
LB
321,14
GND
GND

※1. Pin numbers. The number and assignment of pin numbers differ between TWELITE and TWELITE DIP. Normally, IO names are used to identify pins.

※2. IO names of the pins. These names are used in semiconductor datasheets and TWELITE application development. Our technical support also refers to pins by IO names in principle.

※3. This table lists representative functions. Only a portion of these functions may be supported by the TWENET library.

Electrical Characteristics

ALL

Absolute Maximum Ratings

MinMax
Power Supply-0.33.96V
Reset-0.33.96V
Digital IO-0.33.96V
ADC-0.33.96V
NFC (LA/LB)-0.34.6V
  • The values are based on the semiconductor datasheet.
SymbolConditionMinMax
Supply VoltageVCC1.93.6V
Operating TempTJNo condensation
MW-G-W
-40105°C
No condensation
MW-G-U
-4090°C
  • The values are based on the semiconductor datasheet.

DC Characteristics

SymbolConditionMinTypMax
Current Consump.ICCSleep, SRAM not retained, no timer350nA
Sleep, SRAM not retained, timer enabled800nA
Sleep, SRAM retained (4KB), timer enabled1025nA
Sleep, SRAM retained (8KB), timer enabled1120nA
Active, TX (10dBm)20.28mA
Active, TX (3dBm)9.44mA
Active, TX (0dBm)7.36mA
Active, RX4.3mA
  • The values are based on the semiconductor datasheet.

I/O Characteristics

SymbolConditionMinTypMax
PIO Internal Pull-upRpu(int)(PIO)405060
RSTN Internal Pull-upRpu(int)(RSTN)405060
PIO Internal Pull-downRpdn(int)(PIO)405060
IO High InputVIH0.7*VCCVCCV
IO Low InputVIL-0.30.27*VCCV
IO High OutputVOHPIO0-9,12-16
2mA load (VCC=3.6V)
3.3VCCV
PIO0-9,12-16
2mA load (VCC=3.0V)
2.65VCCV
PIO0-9,12-16
2mA load (VCC=2.4V)
2VCCV
PIO0-9,12-16
2mA load (VCC=1.9V)
1.4VCCV
PIO17-21
5mA load (VCC=3.6V)
3.2VCCV
PIO17-21
5mA load (VCC=3.0V)
2.6VCCV
PIO17-21
5mA load (VCC=2.4V)
2.05VCCV
PIO17-21
5mA load (VCC=1.9V)
1.35VCCV
PIO10,11
2mA load (VCC=3.6V)
3.3VCCV
PIO10,11
2mA load (VCC=3.0V)
2.66VCCV
PIO10,11
2mA load (VCC=2.4V)
2.1VCCV
PIO10,11
2mA load (VCC=1.9V)
1.15VCCV
IO Low OutputVOL00.4V
  • The values are based on the semiconductor datasheet.

ADC Characteristics

SymbolConditionMinTypMax
Input VoltageVi0VCCV
Full Scale RangeFSRAfter calibration3.563.63.62V
Resolution12bits
Current ConsumptionIADCxx=05100uA
Integral NonlinearityINL1.1LSB
Differential NonlinearityDNL0.85LSB
Offset ErrorEOAfter calibration-4.54.5mV
Gain ErrorEGAfter calibration-40020mV
Sampling FrequencyfsSingle channel78.4100190ksps
  • The values are based on the semiconductor datasheet.

Mechanical Characteristics

External Dimensions

SMD
Outline Drawing

Outline Drawing

  • Dimensions: 13.97mm x 13.97mm x 2.5mm
  • Weight: 0.84g (MW-G-W), 0.86g (MW-G-U)
DIP
Outline Drawing (Board Antenna)

Outline Drawing (Board Antenna)

Outline Drawing (U.FL)

Outline Drawing (U.FL)

  • Dimensions: 44.7mm x 18.3mm x 8.1mm
  • Weight: 3.81g (MW-G-DIP-P), 3.83g (MW-G-DIP-U)
SMD
Recommended Pad Layout
  • Do not place silkscreen or through-holes on the receiving PCB area that contacts the module underside.
  • When connecting a wire antenna such as a stick antenna, provide a slot on the receiving PCB and solder from the underside of the module. (See Antenna Opening)
  • Use a metal mask thickness in the range of t = 0.12–0.15mm. Due to the metal mask and reflow conditions, solder fillets may not form on some half-cut vias on one side of the module.

Environmental Regulations

  • Compliant with RoHS (10 substances)

Shield Can

The shield can is soldered at two diagonal points.

Antenna Opening

SMD

When mounting TWELITE to a custom PCB and using a wire antenna such as a stick antenna, create an opening on the board and solder from the underside.

The figure below shows an example opening.

Antenna Opening Example

In this example, pins 29, 30, 31, and 32 (LA, GND, LB, GND) are left unconnected to allow for a wider opening.

Reflow Conditions

SMD

Recommended Reflow Profile

Reflow Profile

Reflow Profile

PreheatingMain HeatingPeak TempReflow Count
150180°C/6090sec220°C/30-45sec245°C1

Ordering Information

Product Codes

ALL
Product NameProduct CodeSales TypePackagingMOQSPQ
TWELITEMW-G-WRetailIndividual Pack11
MW-G-W-BULKWholesaleCut Tape/Tray100100
MW-G-W-REELWholesaleReel10001000
MW-G-URetailIndividual Pack11
MW-G-U-BULKWholesaleCut Tape/Tray100100
MW-G-U-REELWholesaleReel10001000
TWELITE DIPMW-G-DIP-PRetailIndividual Pack11
MW-G-DIP-P-BULKWholesaleTray100100
MW-G-DIP-URetailIndividual Pack11
MW-G-DIP-U-BULKWholesaleTray100100

Product codes are subject to change. For the latest codes, please refer to our website.

Packaging

SMD

Taping Dimensions

Taping Dimensions

Reel Dimensions

Reel Dimensions

Precautions

Mounting Precautions

SMD
  1. The product should be reflow soldered only once under our recommended reflow conditions. Please note that solder inside the product will re-melt during reflow.
  2. This product absorbs moisture when left in a natural environment. Please perform reflow mounting within 72 hours after opening.
  3. Ensure adequate electrostatic discharge (ESD) protection.
  4. If more than 72 hours have passed after opening, perform baking under the following conditions before use:
    • Baking in reels is not allowed; transfer to trays, etc., before baking.
    • Bake at 90°C for 48 hours, up to one time only.
  5. Please note that multiple LOT numbers may be mixed in a single package.
  6. Solder fillets on soldered parts of components mounted inside the product are not required.
  7. This product is intended for mounting on glass epoxy substrates. If mounting on substrates made of materials other than glass epoxy (e.g., ceramics), please conduct thorough evaluation before use.
  8. Due to the nature of components mounted inside the product, they are highly sensitive to static electricity. Ensure full ESD protection when handling.
  9. If stress is applied to the shield case, it may come off. Please handle with care.
  10. For hand soldering, please follow these conditions: temperature below 350°C, within 3 seconds (package surface temperature should be below 150°C).

Export Regulations

ALL

TWELITE is equipped with an AES encryption circuit, and we judge it as a product subject to export control classification. If you require a parameter sheet for export classification, please contact us.

In overseas markets, radio certification may be required. Please consult us at an early stage.

Product Markings

ALL

Product logos, certification numbers, and other markings printed on the product may change without notice.

Factory Firmware

ALL

Writing of TWELITE firmware is performed as part of product inspection during manufacturing (to confirm that information such as serial number and MAC address written to the chip is valid). We cannot guarantee information such as firmware version even upon customer request. The presence or type of firmware written to TWELITE STICK at the time of factory shipment may change without notice. We do not rewrite firmware on shipped products. Please use the TWELITE STAGE App or the Python tweliter module.

Storage Precautions

ALL

Store between 0°C and 40°C, avoiding high temperature and humidity.

SMD

Use the product within 6 months after delivery.

Usage Precautions

ALL

When using the product, always conduct evaluations and confirmations in the actual environment. For applications requiring very high reliability or those involving human life, please contact your distributor in advance.

Revision History

VersionRevision DateDetails of Changes
1.0.02025-06-04First Edition
1.0.0rc22024-07-16Pre-release Version



Arm® and Cortex® are registered trademarks of Arm Limited.

NXP® and NTAG® are registered trademarks of NXP B.V.

2.2 - TWELITE (GOLD Series)

Pre-release version

Introduction

TWELITE® is a compact, low-power, high-performance wireless module.

Equipped with an Arm® Cortex®-M4 core, it supports medium-range wireless communication compliant with IEEE802.15.4 and short-range communication compliant with ISO/IEC 14443.

Certified for radio use in Japan, it enables rapid product development for wireless systems.

Features

  • Ultra-compact body package (13.97mm × 13.97mm × 2.5mm)
  • Medium-range wireless communication compliant with the global standard IEEE802.15.4
  • PCB design that maximizes chip performance and ensures stable communication over long distances
  • Our proprietary simple protocol stack “TWELITE NET”
  • Short-range wireless communication with NFC readers compliant with ISO/IEC 14443
  • Widely used Arm Cortex-M4 architecture
  • Excellent power-saving performance with standby current as low as 350nA, contributing to longer battery life
  • Equipped with 152KB SRAM and 640KB flash memory to support advanced communication application software
  • Six-channel 12-bit ADC and 22 general-purpose digital I/O ports to connect various sensors
  • Ten channels of PWM output usable for LEDs and actuators
  • Newly added 32-bit real-time clock
  • Firmware development environment based on the freely available GNU Arm Embedded Toolchain
  • Strong AES encryption: 128bit / 192bit / 256bit
  • Certified under Japan’s ARIB STD-T66 construction design certification (technical conformity)

Product Variants

The TWELITE Wireless Module (GOLD Series) comes in the following variations. Please select according to your application.

Product NameModel No.Antenna TerminalRemarks
TWELITEMW-G-WWire antenna terminal
(through-hole)
Antenna sold separately
MW-G-UCoaxial antenna terminal
(U.FL/IPEX)
Antenna sold separately
TWELITE DIPMW-G-DIP-PPCB antenna
MW-G-DIP-UCoaxial antenna terminal
(U.FL/IPEX)
Antenna sold separately
Main body: MW-G-W

MW-G-W Appearance

MW-G-W Appearance

MW-G-U Appearance

MW-G-U Appearance

MW-G-DIP-P Appearance

MW-G-DIP-P Appearance

MW-G-DIP-U Appearance

MW-G-DIP-U Appearance

In the following documentation, references related to MW-G-W/U are marked as SMD , those related to MW-G-DIP-P/U as DIP , and those applicable to all as ALL .

Functions

ALL
  • 32-bit Arm Cortex-M4 processor
  • Operating clock: 32MHz (variable between 12MHz and 48MHz to optimize power consumption)
  • SRAM: 152KB
  • Flash memory: 640KB
  • EEPROM: 2KB (mounted on internal NFC chip)
  • Watchdog timer, brown-out detection
  • Power control for each block (Digital/Analog/SRAM/Wireless)
  • AES encryption circuit: 128bit / 192bit / 256bit
  • 6x ADC (12-bit)
  • 10x PWM
  • 2x Timer (32-bit)
  • 1x Comparator
  • 2x UART
  • 2x SPI (with 3 chip selects)
  • 2x I2C
  • 22x Digital IO
  • 1x Quad SPI
  • 1x RTC (32-bit)
Block diagram of TWELITE GOLD series

Block Diagram of TWELITE (GOLD Series)

2.4GHz Wireless

ALL
ItemTWELITE (GOLD Series)Remarks
Communication2.4GHz IEEE 802.15.4
ProtocolTWELITE NET and IEEE 802.15.4 MAC
Data Rate250kbps
ModulationO-QPSK, DSSS
Channels16Varies depending on country
Max TX Power9.14dBm25°C, 3V, typical
RX Sensitivity-99.7dBm25°C, 3V, typical
Antenna
ALL

For a list of compatible antennas, refer to our product information.

SMD

A board antenna that can be mounted on the PCB (MW-A-P1934) is also available. See Board antenna (MW-A-P1934).

Certification
ALL
TWELITE (GOLD Series)
Certification Model NameTWELITE GOLD
Technical Conformity ID007-AL0022
FCC IDTBA
IC IDTBA

NFC Tag

ALL
ItemTWELITE (GOLD Series)Remarks
CommunicationISO/IEC 14443 Type A
ProtocolNFC Forum Type 2 TagNXP® NTAG®
Data Rate106kbps
SRAM64 bytes
EEPROM2KB
Write Time4.8ms4 bytes, EEPROM
0.8ms4 bytes, SRAM
6.1ms64 bytes, SRAM (FAST_WRITE)
Max Range100mmDepends on antenna, etc.

Development Environment

ALL

TWELITE STAGE SDK

TWELITE STAGE SDK is a dedicated firmware development environment for the TWELITE series provided by our company. By using the included TWELITE STAGE APP, you can build, write firmware, verify operation, and configure settings.

The TWELITE STAGE SDK includes the following components:

  • TWELITE STAGE APP (frontend for build operations; executes builds via make using the command-line tool and writes firmware) Located in MWSTAGE/, excluding MWSDK (note 1) and Tools.

  • Toolchain (compiler and other command-line utilities) Located under the MWSTAGE/Tools folder.

  • MWSDK Libraries (used during builds) Located under MWSTAGE/MWSDK (note 1)

Distribution of TWELITE STAGE SDK

The TWELITE STAGE SDK for TWELITE GOLD is distributed by our support team.

Below are the currently distributed versions:

  • MWSTAGE2024_07G (Distributed in July 2024)
    • STAGE App: 2.4.1
    • Toolchain: gcc 12.2.1 20221205
    • MWSDK Library: MWSDK2024_07G

Development Information Specific to TWELITE GOLD

Details on build methods and APIs are documented in .../MWSDK/TWENET/current/index.html under the MWSDK folder.

About MCUXpresso

MCUXpresso is a firmware development environment provided by NXP Semiconductors N.V., the manufacturer of the JN5189 semiconductor mounted on the TWELITE (GOLD Series). In addition to build and write capabilities, it also supports debugging using MCU-Link.

Software License Agreement

For software provided by MONO WIRELESS Inc., please refer to the license descriptions in the LICENSE folder under the MWSDK library within the TWELITE STAGE SDK when developing firmware. Although English versions are available, in the event of conflicting interpretations, the Japanese version shall take precedence.

  • MW-SLA-1J ・・・ MONO WIRELESS Software License Agreement (for commercial use)
  • MW-OSSLA-1J ・・・ MONO WIRELESS Open Source Software License Agreement (includes non-commercial use)
  • MW-SLA-1E1, MW-OSSLA-1E・・・ English versions of the above

Pin Assignment

Pin Number

SMD
Pin Number Assignment

Pin Number Assignment

DIP
Pin Number Assignment

Pin Number Assignment (DIP)

Functions of Each Pin

ALL

The representative functions are shown in the table below.

NameFunction
PIOPeripheral input/output
PWMPulse-width modulation output
TXDUART Data Transmission
RXDUART Data Reception
RTSUART Request to Send (output)
CTSUART Clear to Send (input)
SCLI2C Serial Clock
SDAI2C Serial Data
SCKSPI Serial Clock
MOSISPI Controller Output (PICO)
MISOSPI Controller Input (POCI)
SSELNSPI Peripheral Select (CS)
NameFunction
IOQuad SPI Serial Data
CSNQuad SPI Chip Select
CLKQuad SPI Serial Clock
MATTimer Output
CAPTimer Input
OUTComparator Output
ACPComparator + Input
ACMComparator - Input
SWDIOSWD Serial Data
SWOSWD Trace Port
SWCLKSWD Serial Clock
ISPENTISP Entry
ISPSELISP Mode Select

The typical function assignments are shown in the following table.

SMD
#
Note 1
DIP
# (14P)
Note 1
IO
Note 2
PWM
Note 3
ADC
Note 3
UART
Note 3
I2C
Note 3
SPI
Note 3
Quad
SPI
Note 3
Timer
(CT32)
Note 3
Comparator
Note 3
SWD
ISP
Note 3
16PIO0PWM0TXD1SCK1
27
(PRG)
PIO5RTS0SSELN0
MISO1
SSELN1(2)
ISPENT
35PIO2PWM2RXD0SCK0
MOSI1
48PIO3PWM3TXD0MISO0
SSELN1(0)
528
(VCC)
VCC
69PIO7PWM7CTS0
RXD1
SDA1MISO0CT32B1
MAT1
74PIO6PWM6RTS0
TXD1
SCL1SCK0CT32B1
MAT0
810
(TXD)
PIO8PWM8TXD0MOSI0CT32B0
MAT0
OUT
93
(RXD)
PIO9PWM9RXD0SSELN0CT32B1
CAP1
1011
(A)
PIO14PWM1ADC0SSELN1(1)CT32B0
CAP1
SWO
1112PIO12PWM0SCL1MOSI0OUTSWCLK
1213PIO4PWM4CTS0MOSI0
SSELN1(1)
ISPSEL
1315
(SET)
PIO13PWM2SDA1MOSI0SWDIO
142PIO10TXD1SCL0SCK0CT32B0
CAP0
1516PIO1PWM1RXD1MISO1
1617PIO0PWM0TXD1SCK1
1719PIO11RXD1SDA0MISO0CT32B1
CAP0
1818PIO20PWM8TXD1IO2ACP
1920PIO21PWM9IO1ACMSWO
201,14GND
2121
(RST)
RSTN
2224
(A)
PIO14PWM1ADC0SSELN1(1)CT32B0
CAP1
SWO
2322
(B)
PIO15PWM3ADC1SCL0SCK1OUT
2423
(C)
PIO16PWM5ADC2SDA0SSELN1(0)CSN
2525
(D)
PIO17PWM6ADC3MOSI1IO3SWO
2626
(E)
PIO18PWM7ADC4TXD0MISO1CLKCT32B0
MAT1
2727PIO19PWM4ADC5RXD0
RXD1
IO0
281,14
(GND)
GND
29N/A
(ANT R)
LA
301,14
GND
GND
31N/A
(ANT L)
LB
321,14
GND
GND

Note 1. These are the pin numbers. TWELITE and TWELITE DIP have different counts and assignments. IO names are generally used to identify pins.

Note 2. IO names of the pins. These names are used in semiconductor datasheets and TWELITE application development. Our technical support also refers to pins by IO names in principle.

Note 3. This table lists representative functions. Only a subset is supported in the TWENET library.

Electrical Characteristics

ALL

Absolute Maximum Ratings

MinMax
Power Supply-0.33.96V
Reset-0.33.96V
Digital I/O-0.33.96V
ADC-0.33.96V
NFC (LA/LB)-0.34.6V

Values are based on the semiconductor datasheet.

SymbolConditionMinMax
Supply VoltageVCC1.93.6V
Operating TempTJNo condensation
MW-G-W
-40105°C
No condensation
MW-G-U
-4090°C

Values are based on the semiconductor datasheet.

DC Characteristics

SymbolConditionMinTypMax
Current Cons.ICCSleep, SRAM not retained, no timer350nA
Sleep, SRAM not retained, with timer800nA
Sleep, 4KB SRAM retained, with timer1025nA
Sleep, 8KB SRAM retained, with timer1120nA
Active, TX (10dBm)20.28mA
Active, TX (3dBm)9.44mA
Active, TX (0dBm)7.36mA
Active, RX4.3mA

Values are based on the semiconductor datasheet.

I/O Characteristics

SymbolConditionMinTypMax
PIO Pull-up ResistorRpu(int)(PIO)405060
RSTN Pull-up ResistorRpu(int)(RSTN)405060
PIO Pull-down ResistorRpdn(int)(PIO)405060
IO Input HighVIH0.7 * VCCVCCV
IO Input LowVIL-0.30.27 * VCCV
IO Output HighVOHPIO0-9,12-16, 2mA load (VCC=3.6V)3.3VCCV
PIO0-9,12-16, 2mA load (VCC=3.0V)2.65VCCV
PIO0-9,12-16, 2mA load (VCC=2.4V)2.0VCCV
PIO0-9,12-16, 2mA load (VCC=1.9V)1.4VCCV
PIO17-21, 5mA load (VCC=3.6V)3.2VCCV
PIO17-21, 5mA load (VCC=3.0V)2.6VCCV
PIO17-21, 5mA load (VCC=2.4V)2.05VCCV
PIO17-21, 5mA load (VCC=1.9V)1.35VCCV
PIO10,11, 2mA load (VCC=3.6V)3.3VCCV
PIO10,11, 2mA load (VCC=3.0V)2.66VCCV
PIO10,11, 2mA load (VCC=2.4V)2.1VCCV
PIO10,11, 2mA load (VCC=1.9V)1.15VCCV
IO Output LowVOL00.4V

Values are based on the semiconductor datasheet.

ADC Characteristics

SymbolConditionMinTypMax
Input VoltageVi0VCCV
Full Scale RangeFSRAfter calibration3.563.63.62V
Resolution12bits
Current ConsumptionIADCxx=05100µA
Integral Non-linearityINL1.1LSB
Differential Non-linearityDNL0.85LSB
Offset ErrorEOAfter calibration-4.54.5mV
Gain ErrorEGAfter calibration-40020mV
Sampling FrequencyfsSingle channel78.4100190ksps

Values are based on the semiconductor datasheet.

Mechanical Characteristics

External Dimensions

SMD
Outline Drawing

Outline Drawing

  • Dimensions: 13.97mm x 13.97 mm x 2.5mm
  • Weight: 0.84g (MW-G-W), 0.86g (MW-G-U)
DIP
Outline Drawing (PCB Antenna)

Outline Drawing (PCB Antenna)

Outline Drawing (U.FL)

Outline Drawing (U.FL)

  • Dimensions: 44.7mm x 18.3 mm x 8.1mm
  • Weight: 3.81g (MW-G-DIP-P), 3.83g (MW-G-DIP-U)
SMD
Recommended Pad Layout
  • Do not place silk screen or through-holes on the receiving PCB area that contacts the back of the module.
  • When connecting wire antennas such as matchstick antennas, create a rectangular hole in the receiving PCB and solder from the back side. (See Antenna Mounting Opening)
  • Use a metal mask thickness in the range of t = 0.12 to 0.15mm. Depending on the metal mask and reflow conditions, solder fillets may not form on some half-holes of the module.

Environmental Regulations

RoHS (10 substances) compliance is planned (note: under analysis).

Shield Can

The shield can is soldered at two diagonal points.

Antenna Mounting Opening

SMD

To connect a matchstick or similar wire antenna when mounting TWELITE on a custom board, create an opening on the board and solder from the back side.

The following figure is one example of such an opening.

Antenna Mounting Opening

In this example, pins 29, 30, 31, 32 (LA, GND, LB, GND) are left unconnected to allow for a larger opening.

Reflow Conditions

SMD

Recommended Reflow Profile

Reflow Profile

Reflow Profile

PreheatingMain HeatingPeak TempReflow Count
150180°C/6090sec220°C/30-45sec245°C1

Ordering Information

Sales Code

ALL
Product NameSales CodeSales TypePackagingMOQSPQ
TWELITEMW-G-WRetailIndividual Pack11
MW-G-W-BULKWholesaleCut Tape / Tray100100
MW-G-W-REELWholesaleReel10001000
MW-G-URetailIndividual Pack11
MW-G-U-BULKWholesaleCut Tape / Tray100100
MW-G-U-REELWholesaleReel10001000
TWELITE DIPMW-G-DIP-PRetailIndividual Pack11
MW-G-DIP-P-BULKWholesaleTray100100
MW-G-DIP-URetailIndividual Pack11
MW-G-DIP-U-BULKWholesaleTray100100

Sales codes are subject to change. Please refer to our website for the latest information.

Packaging

SMD

Taping Dimensions

Taping Dimensions

Reel Dimensions

Reel Dimensions

Notes

Mounting Precautions

SMD
  1. The recommended number of reflows is one. During reflow, internal solder may re-melt; handle with care.
  2. This product is moisture-sensitive. Please perform reflow within 72 hours after opening.
  3. Use proper anti-static precautions.
  4. If 72 hours have passed after opening, perform a baking process under the following conditions before use:
    • Do not bake in the reel. Transfer to a tray or similar.
    • Bake at 90°C for 48 hours, only once.
  5. Multiple LOT numbers may be mixed in one package.
  6. Presence or absence of solder fillets on mounted parts is not guaranteed.
  7. Designed for mounting on FR-4 (glass epoxy). If using a different substrate (e.g., ceramic), evaluate thoroughly beforehand.
  8. Components mounted inside the product are highly sensitive to static electricity. Ensure sufficient static protection.
  9. The shield case may come off under stress. Please handle with care.
  10. For hand soldering, follow these conditions: ≤350°C, ≤3 seconds (≤150°C on package surface).

Export Control

ALL
  • The AES encryption circuit in TWELITE falls under controlled goods. Contact us for the parameter sheet.
  • Depending on the destination, radio certification may be required for customs clearance. Contact us regarding country-specific regulations.

Product Marking

ALL

Product logos and certification numbers printed on the product may change without notice.

Factory Default Firmware

ALL

TWELITE (MW-G-W/U, MW-G-DIP-P/U) is shipped with the “Extremely Simple! Standard App (App_Twelite)” pre-installed (at the time of this datasheet’s creation). This app is written during manufacturing to verify chip configuration (e.g., serial number and MAC address), and firmware version information will not be disclosed upon request.

Please note that the presence or type of pre-installed firmware may change without notice. Always write the necessary firmware in your own manufacturing process. We do not provide reflashing services for shipped products.

Storage Precautions

ALL

Store at temperatures between 0°C and 40°C, avoiding high temperature and humidity.

SMD

Use the product within 6 months of delivery.

Usage Notes

ALL

Always evaluate and verify in your actual usage environment. For high-reliability or life-critical applications, consult your distributor beforehand.

Revision History

VersionDateDescription
1.0.0rc22024-07-16Initial version released



Arm® and Cortex® are registered trademarks of Arm Limited.

NXP® and NTAG® are registered trademarks of NXP B.V.