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As of 2025-07-24

TWELITE (GOLD Series)

Latest Edition

Introduction

TWELITE® is a compact, low-power, and high-performance wireless module.

Equipped with an Arm® Cortex®-M4 core, it supports mid-range wireless communication compliant with IEEE802.15.4 and short-range communication compliant with ISO/IEC 14443.

It has obtained domestic radio certification in Japan, enabling rapid productization of wireless systems.

Features

Ultra-compact package (13.97mm × 13.97mm × 2.5mm)
Mid-range wireless communication compliant with global standard IEEE802.15.4
PCB design that maximizes chip performance and ensures stable communication over long distances
Our proprietary simple protocol stack “TWELITE NET”
Short-range communication with NFC readers compliant with ISO/IEC 14443
Widely used Arm Cortex-M4 architecture
Excellent power-saving performance with minimum standby current of 350nA, contributing to battery life
Equipped with 152KB SRAM and 640KB flash memory, supporting advanced communication application software
6-channel 12-bit ADC and 22 general-purpose digital I/O ports to connect various sensors
10-channel PWM output, applicable to LEDs and actuators
Newly equipped 32-bit real-time clock
Firmware development environment based on the free GNU Arm Embedded Toolchain
Strong AES encryption with 128bit / 192bit / 256bit
Certified under Japan’s ARIB STD-T66 (technical conformity certification)

Some semiconductor functions listed above may not be supported by TWELITE NET.

Product Variants

The TWELITE wireless module (GOLD Series) is available in the following variants. Please select according to your application.

Product Name	Model Number	Antenna Terminal	Remarks
TWELITE	MW-G-W	Wire antenna terminal (through-hole)	Antenna sold separately
	MW-G-U	Coaxial antenna terminal (U.FL/IPEX)	Antenna sold separately
TWELITE DIP	MW-G-DIP-P	On-board antenna
	MW-G-DIP-U	Coaxial antenna terminal (U.FL/IPEX)	Antenna sold separately Main unit is MW-G-W

In the following document, the tag SMD indicates sections related to MW-G-W/U, DIP for MW-G-DIP-P/U, and ALL for content relevant to all models.

Functions

ALL

32-bit Arm Cortex-M4 processor
Operating clock: 32MHz (clock can be adjusted from 12MHz to 48MHz to optimize power consumption)
SRAM: 152KB
Flash memory: 640KB
EEPROM: 2KB (included in the built-in NFC chip)
Watchdog timer and brown-out detection
Power control for each block (digital/analog/SRAM/wireless)
AES encryption circuit supporting 128bit/192bit/256bit
6x ADC (12bit)
10x PWM
2x Timers (32bit)
1x Comparator
2x UART
2x SPI (3 chip selects)
2x I2C
22x Digital IO
1x Quad SPI
1x RTC (32bit)

Many I/O pins are multiplexed; some combinations may not be available simultaneously.

Block diagram of TWELITE GOLD Series — Block Diagram of TWELITE (GOLD Series)

2.4GHz Wireless

ALL

Item	TWELITE (GOLD Series)	Remarks
Communication	2.4GHz IEEE 802.15.4
Protocol	TWELITE NET and IEEE 802.15.4 MAC
Data Rate	250kbps
Modulation	O-QPSK, DSSS
Channels	16	Varies by country
Max TX Power	9.14dBm	25°C, 3V, typ
RX Sensitivity	-99.7dBm	25°C, 3V, typ

Antennas

ALL

For a list of compatible antennas, please refer to our product information.

SMD

A PCB-mountable antenna MW-A-P1934 is also available.

Using antennas not designed for TWELITE requires separate radio certification.

Certifications

ALL

	TWELITE (GOLD Series)
Certification Model	TWELITE GOLD
Technical Conformity Certification Number	007-AL0022

When using TWELITE overseas, there may be various restrictions such as on the types of antennas that can be used.

Please contact us during the early stages of development.

NFC Tag

ALL

Item	TWELITE (GOLD Series)	Remarks
Communication	ISO/IEC 14443 Type A
Protocol	NFC Forum Type 2 Tag	NXP® NTAG®
Data Rate	106kbps
SRAM	64bytes
EEPROM	2KB
Write Speed	4.8ms	4bytes, EEPROM
	0.8ms	4bytes, SRAM
	6.1ms	64bytes, SRAM (`FAST_WRITE`)
Max Distance	100mm	Depends on antenna configuration

Development Environment

ALL

TWELITE STAGE SDK

TWELITE STAGE SDK is a dedicated firmware development environment for the TWELITE series provided by our company. Using the included application TWELITE STAGE APP, you can build and write firmware, as well as check the operation and change settings of existing firmware.

For usage instructions, refer to the documents included with the TWELITE STAGE SDK.
Documentation on the website may reflect newer versions of TWELITE STAGE SDK and the application, and thus may differ in content from the version you are using.

The TWELITE STAGE SDK consists of the following:

TWELITE STAGE APP (frontend for building, which uses command-line make for compilation and performs firmware writing): all except MWSDK (Note 1) and Tools under MWSTAGE/
Toolchain (utilities and command-line tools such as compiler): under MWSTAGE/Tools
MWSDK library (libraries used in builds): under MWSTAGE/MWSDK (Note 1)

Note 1: The MWSDK folder may contain older library versions. In such cases, folder names like MWSDK20XX_YY are used.
The toolchain gcc and the MWSDK library version directly affect the generated binaries.

Distribution of TWELITE STAGE SDK

The TWELITE STAGE SDK for TWELITE GOLD is distributed through our support service.

Below are the major versions currently available:

MWSTAGE2024_07G distributed in July 2024
- STAGE App: 2.4.1
- Toolchain: gcc 12.2.1 20221205
- MWSDK Library: MWSDK2024_07G

TWELITE GOLD-Specific Development Information

The .../MWSDK/TWENET/current/index.html file under the MWSDK folder contains descriptions about build methods and APIs.

About MCUXpresso

MCUXpresso is a firmware development environment provided by NXP Semiconductors N.V., the manufacturer of the JN5189 semiconductor used in TWELITE (GOLD Series). It allows not only building and writing firmware but also debugging using MCU-Link.

Please note that we do not provide support for tools offered by semiconductor manufacturers.

About Software Licensing

When developing firmware using the TWELITE STAGE SDK provided by Mono Wireless Inc., please refer to the license descriptions in the LICENSE folder under the MWSDK library as the primary source. English versions of the licenses are available, but in the event of any dispute or discrepancy, the Japanese version shall take precedence.

MW-SLA-1J — Mono Wireless Software License Agreement (intended for commercial use)
MW-OSSLA-1J — Mono Wireless Open Source Software License Agreement (considering non-commercial use)
MW-SLA-1E1, MW-OSSLA-1E — English versions of the above

Refer to the license descriptions included in the source code to understand the applicable license.
- Source code created by Mono Wireless Inc. is generally licensed under either MW-SLA or MW-OSSLA.
For tool licenses, refer to the distribution directories of the TWELITE STAGE SDK.
- For the TWELITE STAGE APP license, refer to the contents under MWSTAGE/TWELITE_Stage/LICENSE in the SDK distribution.

Pin Assignment

Pin Number

SMD

DIP

Pin Functions

ALL

The typical functions are shown in the table below.

Name	Function
PIO	Peripheral Input/Output
PWM	Pulse Width Modulation Output
TXD	UART Data Transmission
RXD	UART Data Reception
RTS	UART Data Transmission Request Output
CTS	UART Data Transmission Request Input
SCL	I2C Serial Clock
SDA	I2C Serial Data
SCK	SPI Serial Clock
MOSI	SPI Controller Output (PICO)
MISO	SPI Controller Input (POCI)
SSELN	SPI Peripheral Select (CS)

Name	Function
IO	Quad SPI Serial Data
CSN	Quad SPI Chip Select
CLK	Quad SPI Serial Clock
MAT	Timer Output
CAP	Timer Input
OUT	Comparator Output
ACP	Comparator + Input
ACM	Comparator - Input
SWDIO	SWD Serial Data
SWO	SWD Trace Port
SWCLK	SWD Serial Clock
ISPENT	ISP Entry
ISPSEL	ISP Mode Select

The typical assignments of functions are shown in the table below.

SMD# Note1	DIP# (14P) Note1	IO Note2	PWM Note3	ADC Note3	UART Note3	I2C Note3	SPI Note3	Quad SPI Note3	Timer (CT32) Note3	Comparator Note3	SWD ISP Note3
1	6	PIO0	PWM0		TXD1		SCK1
2	7 (PRG)	PIO5			RTS0		SSELN0 MISO1 SSELN1(2)				ISPENT
3	5	PIO2	PWM2		RXD0		SCK0 MOSI1
4	8	PIO3	PWM3		TXD0		MISO0 SSELN1(0)
5	28 (VCC)	VCC
6	9	PIO7	PWM7		CTS0 RXD1	SDA1	MISO0		CT32B1 MAT1
7	4	PIO6	PWM6		RTS0 TXD1	SCL1	SCK0		CT32B1 MAT0
8	10 (TXD)	PIO8	PWM8		TXD0		MOSI0		CT32B0 MAT0	OUT
9	3 (RXD)	PIO9	PWM9		RXD0		SSELN0		CT32B1 CAP1
10	11 (A)	PIO14	PWM1	ADC0			SSELN1(1)		CT32B0 CAP1		SWO
11	12	PIO12	PWM0			SCL1	MOSI0			OUT	SWCLK
12	13	PIO4	PWM4		CTS0		MOSI0 SSELN1(1)				ISPSEL
13	15 (SET)	PIO13	PWM2			SDA1	MOSI0				SWDIO
14	2	PIO10			TXD1	SCL0	SCK0		CT32B0 CAP0
15	16	PIO1	PWM1		RXD1		MISO1
16	17	PIO0	PWM0		TXD1		SCK1
17	19	PIO11			RXD1	SDA0	MISO0		CT32B1 CAP0
18	18	PIO20	PWM8		TXD1			IO2		ACP
19	20	PIO21	PWM9					IO1		ACM	SWO
20	1,14	GND
21	21 (RST)	RSTN
22	24 (A)	PIO14	PWM1	ADC0			SSELN1(1)		CT32B0 CAP1		SWO
23	22 (B)	PIO15	PWM3	ADC1		SCL0	SCK1			OUT
24	23 (C)	PIO16	PWM5	ADC2		SDA0	SSELN1(0)	CSN
25	25 (D)	PIO17	PWM6	ADC3			MOSI1	IO3			SWO
26	26 (E)	PIO18	PWM7	ADC4	TXD0		MISO1	CLK	CT32B0 MAT1
27	27	PIO19	PWM4	ADC5	RXD0 RXD1			IO0
28	1,14 (GND)	GND
29	N/A (ANT R)	LA
30	1,14 GND	GND
31	N/A (ANT L)	LB
32	1,14 GND	GND

※1. Pin numbers. The number and assignment of pin numbers differ between TWELITE and TWELITE DIP. Normally, IO names are used to identify pins.

※2. IO names of the pins. These names are used in semiconductor datasheets and TWELITE application development. Our technical support also refers to pins by IO names in principle.

※3. This table lists representative functions. Only a portion of these functions may be supported by the TWENET library.

For compatibility with the TWELITE BLUE/RED series, the following pins are internally connected:

PIO0: SMD#1 and SMD#16
PIO14: SMD#10 and SMD#22

Since ADC pins are shared with PIO pins, internal pull-ups must be disabled to read analog voltage values.

It is recommended to connect all GND pins SMD#28, 30, and 32. However, operation without connecting them is also possible.

Even when these pins are left unconnected, no significant change in wireless performance has been observed.

Electrical Characteristics

ALL

Absolute Maximum Ratings

	Min	Max
Power Supply	-0.3	3.96	V
Reset	-0.3	3.96	V
Digital IO	-0.3	3.96	V
ADC	-0.3	3.96	V
NFC (LA/LB)	-0.3	4.6	V

The values are based on the semiconductor datasheet.

Recommended Operating Conditions

	Symbol	Condition	Min	Max
Supply Voltage	VCC		1.9	3.6	V
Operating Temp	T_J	No condensation MW-G-W	-40	105	°C
		No condensation MW-G-U	-40	90	°C

The values are based on the semiconductor datasheet.

DC Characteristics

	Symbol	Condition	Typ
Current Consump.	I_CC	Sleep, SRAM not retained, no timer	350	nA
		Sleep, SRAM not retained, timer enabled	800	nA
		Sleep, SRAM retained (4KB), timer enabled	1025	nA
		Sleep, SRAM retained (8KB), timer enabled	1120	nA
		Active, TX (10dBm)	20.28	mA
		Active, TX (3dBm)	9.44	mA
		Active, TX (0dBm)	7.36	mA
		Active, RX	4.3	mA

The values are based on the semiconductor datasheet.

I/O Characteristics

	Symbol	Condition	Min	Typ	Max
PIO Internal Pull-up	R_pu(int)(PIO)		40	50	60	kΩ
RSTN Internal Pull-up	R_{pu(int)(RSTN)}		40	50	60	kΩ
PIO Internal Pull-down	R_{pdn(int)(PIO)}		40	50	60	kΩ
IO High Input	V_IH		0.7*VCC		VCC	V
IO Low Input	V_IL		-0.3		0.27*VCC	V
IO High Output	V_OH	PIO0-9,12-16 2mA load (VCC=3.6V)	3.3		VCC	V
		PIO0-9,12-16 2mA load (VCC=3.0V)	2.65		VCC	V
		PIO0-9,12-16 2mA load (VCC=2.4V)	2		VCC	V
		PIO0-9,12-16 2mA load (VCC=1.9V)	1.4		VCC	V
		PIO17-21 5mA load (VCC=3.6V)	3.2		VCC	V
		PIO17-21 5mA load (VCC=3.0V)	2.6		VCC	V
		PIO17-21 5mA load (VCC=2.4V)	2.05		VCC	V
		PIO17-21 5mA load (VCC=1.9V)	1.35		VCC	V
		PIO10,11 2mA load (VCC=3.6V)	3.3		VCC	V
		PIO10,11 2mA load (VCC=3.0V)	2.66		VCC	V
		PIO10,11 2mA load (VCC=2.4V)	2.1		VCC	V
		PIO10,11 2mA load (VCC=1.9V)	1.15		VCC	V
IO Low Output	V_OL		0		0.4	V

The values are based on the semiconductor datasheet.

ADC Characteristics

	Symbol	Condition	Min	Typ	Max
Input Voltage	V_i		0		VCC	V
Full Scale Range	FSR	After calibration	3.56	3.6	3.62	V
Resolution					12	bits
Current Consumption	I_ADCx	x=05		100		uA
Integral Nonlinearity	INL			1.1		LSB
Differential Nonlinearity	DNL			0.85		LSB
Offset Error	E_O	After calibration	-4.5		4.5	mV
Gain Error	E_G	After calibration	-40	0	20	mV
Sampling Frequency	f_s	Single channel	78.4	100	190	ksps

The values are based on the semiconductor datasheet.

Mechanical Characteristics

External Dimensions

SMD

Dimensions: 13.97mm x 13.97mm x 2.5mm
Weight: 0.84g (MW-G-W), 0.86g (MW-G-U)

DXF data for the external shape of the TWELITE BLUE / RED / GOLD Series (SMD) can be downloaded from our website.

DIP

Dimensions: 44.7mm x 18.3mm x 8.1mm
Weight: 3.81g (MW-G-DIP-P), 3.83g (MW-G-DIP-U)

Recommended Pad Dimensions

SMD

Do not place silkscreen or through-holes on the receiving PCB area that contacts the module underside.
When connecting a wire antenna such as a stick antenna, provide a slot on the receiving PCB and solder from the underside of the module. (See Antenna Opening)
Use a metal mask thickness in the range of t = 0.12–0.15mm. Due to the metal mask and reflow conditions, solder fillets may not form on some half-cut vias on one side of the module.

Environmental Regulations

Compliant with RoHS (10 substances)

Shield Can

The shield can is soldered at two diagonal points.

A thin solder plating may be spread over the top of the shield can. This does not affect functionality.

Antenna Opening

SMD

When mounting TWELITE to a custom PCB and using a wire antenna such as a stick antenna, create an opening on the board and solder from the underside.

The figure below shows an example opening.

In this example, pins 29, 30, 31, and 32 (LA, GND, LB, GND) are left unconnected to allow for a wider opening.

Reflow Conditions

SMD

Soldering should, in principle, be performed using reflow soldering.

Recommended Reflow Profile

Reflow Profile

Preheating	Main Heating	Peak Temp	Reflow Count
150~~180°C/60~~90sec	220°C/30-45sec	245°C	1

We have confirmed through evaluation that there are no issues with the above profile, but please verify it under your own mounting conditions.

Ordering Information

Product Codes

ALL

Product Name	Product Code	Sales Type	Packaging	MOQ	SPQ
TWELITE	MW-G-W	Retail	Individual Pack	1	1
	MW-G-W-BULK	Wholesale	Cut Tape/Tray	100	100
	MW-G-W-REEL	Wholesale	Reel	1000	1000
	MW-G-U	Retail	Individual Pack	1	1
	MW-G-U-BULK	Wholesale	Cut Tape/Tray	100	100
	MW-G-U-REEL	Wholesale	Reel	1000	1000
TWELITE DIP	MW-G-DIP-P	Retail	Individual Pack	1	1
	MW-G-DIP-P-BULK	Wholesale	Tray	100	100
	MW-G-DIP-U	Retail	Individual Pack	1	1
	MW-G-DIP-U-BULK	Wholesale	Tray	100	100

Product codes are subject to change. For the latest codes, please refer to our website.

Packaging

SMD

Taping Dimensions

Reel Dimensions

Precautions

Mounting Precautions

SMD

The product should be reflow soldered only once under our recommended reflow conditions. Please note that solder inside the product will re-melt during reflow.
This product absorbs moisture when left in a natural environment. Please perform reflow mounting within 72 hours after opening.
Ensure adequate electrostatic discharge (ESD) protection.
If more than 72 hours have passed after opening, perform baking under the following conditions before use:
- Baking in reels is not allowed; transfer to trays, etc., before baking.
- Bake at 90°C for 48 hours, up to one time only.
Please note that multiple LOT numbers may be mixed in a single package.
Solder fillets on soldered parts of components mounted inside the product are not required.
This product is intended for mounting on glass epoxy substrates. If mounting on substrates made of materials other than glass epoxy (e.g., ceramics), please conduct thorough evaluation before use.
Due to the nature of components mounted inside the product, they are highly sensitive to static electricity. Ensure full ESD protection when handling.
If stress is applied to the shield case, it may come off. Please handle with care.
For hand soldering, please follow these conditions: temperature below 350°C, within 3 seconds (package surface temperature should be below 150°C).

Export Regulations

ALL

TWELITE is equipped with an AES encryption circuit, and we judge it as a product subject to export control classification. If you require a parameter sheet for export classification, please contact us.

In overseas markets, radio certification may be required. Please consult us at an early stage.

Product Markings

ALL

Product logos, certification numbers, and other markings printed on the product may change without notice.

Factory Firmware

ALL

Writing of TWELITE firmware is performed as part of product inspection during manufacturing (to confirm that information such as serial number and MAC address written to the chip is valid). We cannot guarantee information such as firmware version even upon customer request. The presence or type of firmware written to TWELITE STICK at the time of factory shipment may change without notice. We do not rewrite firmware on shipped products. Please use the TWELITE STAGE App or the Python tweliter module.

Storage Precautions

ALL

Store between 0°C and 40°C, avoiding high temperature and humidity.

SMD

Use the product within 6 months after delivery.

Usage Precautions

ALL

When using the product, always conduct evaluations and confirmations in the actual environment. For applications requiring very high reliability or those involving human life, please contact your distributor in advance.

Revision History

Version	Revision Date	Details of Changes
1.0.0	2025-06-04	First Edition
1.0.0rc2	2024-07-16	Pre-release Version

Arm® and Cortex® are registered trademarks of Arm Limited.

NXP® and NTAG® are registered trademarks of NXP B.V.