TWELITE (GOLD Series)

Pre-release version

Introduction

TWELITE® is a compact, low-power, high-performance wireless module.

Equipped with an Arm® Cortex®-M4 core, it supports medium-range wireless communication compliant with IEEE802.15.4 and short-range communication compliant with ISO/IEC 14443.

Certified for radio use in Japan, it enables rapid product development for wireless systems.

Features

Ultra-compact body package (13.97mm × 13.97mm × 2.5mm)
Medium-range wireless communication compliant with the global standard IEEE802.15.4
PCB design that maximizes chip performance and ensures stable communication over long distances
Our proprietary simple protocol stack “TWELITE NET”
Short-range wireless communication with NFC readers compliant with ISO/IEC 14443
Widely used Arm Cortex-M4 architecture
Excellent power-saving performance with standby current as low as 350nA, contributing to longer battery life
Equipped with 152KB SRAM and 640KB flash memory to support advanced communication application software
Six-channel 12-bit ADC and 22 general-purpose digital I/O ports to connect various sensors
Ten channels of PWM output usable for LEDs and actuators
Newly added 32-bit real-time clock
Firmware development environment based on the freely available GNU Arm Embedded Toolchain
Strong AES encryption: 128bit / 192bit / 256bit
Certified under Japan’s ARIB STD-T66 construction design certification (technical conformity)

Some of the semiconductor functions listed above may not be supported in TWELITE NET.

Product Variants

The TWELITE Wireless Module (GOLD Series) comes in the following variations. Please select according to your application.

Product Name	Model No.	Antenna Terminal	Remarks
TWELITE	MW-G-W	Wire antenna terminal (through-hole)	Antenna sold separately
	MW-G-U	Coaxial antenna terminal (U.FL/IPEX)	Antenna sold separately
TWELITE DIP	MW-G-DIP-P	PCB antenna
	MW-G-DIP-U	Coaxial antenna terminal (U.FL/IPEX)	Antenna sold separately Main body: MW-G-W

In the following documentation, references related to MW-G-W/U are marked as SMD , those related to MW-G-DIP-P/U as DIP , and those applicable to all as ALL .

Functions

ALL

32-bit Arm Cortex-M4 processor
Operating clock: 32MHz (variable between 12MHz and 48MHz to optimize power consumption)
SRAM: 152KB
Flash memory: 640KB
EEPROM: 2KB (mounted on internal NFC chip)
Watchdog timer, brown-out detection
Power control for each block (Digital/Analog/SRAM/Wireless)
AES encryption circuit: 128bit / 192bit / 256bit
6x ADC (12-bit)
10x PWM
2x Timer (32-bit)
1x Comparator
2x UART
2x SPI (with 3 chip selects)
2x I2C
22x Digital IO
1x Quad SPI
1x RTC (32-bit)

Since many I/O pins are multiplexed, some combinations may not be usable simultaneously.

Block diagram of TWELITE GOLD series — Block Diagram of TWELITE (GOLD Series)

2.4GHz Wireless

ALL

Item	TWELITE (GOLD Series)	Remarks
Communication	2.4GHz IEEE 802.15.4
Protocol	TWELITE NET and IEEE 802.15.4 MAC
Data Rate	250kbps
Modulation	O-QPSK, DSSS
Channels	16	Varies depending on country
Max TX Power	9.14dBm	25°C, 3V, typical
RX Sensitivity	-99.7dBm	25°C, 3V, typical

Antenna

ALL

For a list of compatible antennas, refer to our product information.

SMD

A board antenna that can be mounted on the PCB (MW-A-P1934) is also available. See Board antenna (MW-A-P1934).

If you use an antenna not certified for TWELITE, new radio certification must be obtained.

Certification

ALL

	TWELITE (GOLD Series)
Certification Model Name	TWELITE GOLD
Technical Conformity ID	007-AL0022
FCC ID	TBA
IC ID	TBA

When using TWELITE overseas, please note that restrictions may apply to the type of antennas and other conditions.

Please consult us during the early stage of your development.

Depending on the country or region, it may be required to display FCC ID or IC ID on the TWELITE module or the product.

If unsure, please contact us for confirmation.

NFC Tag

ALL

Item	TWELITE (GOLD Series)	Remarks
Communication	ISO/IEC 14443 Type A
Protocol	NFC Forum Type 2 Tag	NXP® NTAG®
Data Rate	106kbps
SRAM	64 bytes
EEPROM	2KB
Write Time	4.8ms	4 bytes, EEPROM
	0.8ms	4 bytes, SRAM
	6.1ms	64 bytes, SRAM (`FAST_WRITE`)
Max Range	100mm	Depends on antenna, etc.

Development Environment

ALL

TWELITE STAGE SDK

TWELITE STAGE SDK is a dedicated firmware development environment for the TWELITE series provided by our company. By using the included TWELITE STAGE APP, you can build, write firmware, verify operation, and configure settings.

For usage instructions, please refer to the documentation included with the TWELITE STAGE SDK.
Materials on the website may reflect newer versions of the TWELITE STAGE SDK or applications, which may differ from the specifications of the version you are using.

The TWELITE STAGE SDK includes the following components:

TWELITE STAGE APP (frontend for build operations; executes builds via make using the command-line tool and writes firmware) Located in MWSTAGE/, excluding MWSDK (note 1) and Tools.
Toolchain (compiler and other command-line utilities) Located under the MWSTAGE/Tools folder.
MWSDK Libraries (used during builds) Located under MWSTAGE/MWSDK (note 1)

Note 1: In addition to the latest version, older library versions may also be included in the MWSDK folder. These are placed in folders named by version, such as MWSDK20XX_YY.
The binaries generated during the build are directly affected by the version of the gcc toolchain and the MWSDK library.

Distribution of TWELITE STAGE SDK

The TWELITE STAGE SDK for TWELITE GOLD is distributed by our support team.

Below are the currently distributed versions:

MWSTAGE2024_07G (Distributed in July 2024)
- STAGE App: 2.4.1
- Toolchain: gcc 12.2.1 20221205
- MWSDK Library: MWSDK2024_07G

Development Information Specific to TWELITE GOLD

Details on build methods and APIs are documented in .../MWSDK/TWENET/current/index.html under the MWSDK folder.

About MCUXpresso

MCUXpresso is a firmware development environment provided by NXP Semiconductors N.V., the manufacturer of the JN5189 semiconductor mounted on the TWELITE (GOLD Series). In addition to build and write capabilities, it also supports debugging using MCU-Link.

We do not provide support for tools offered by semiconductor manufacturers.

Software License Agreement

For software provided by MONO WIRELESS Inc., please refer to the license descriptions in the LICENSE folder under the MWSDK library within the TWELITE STAGE SDK when developing firmware. Although English versions are available, in the event of conflicting interpretations, the Japanese version shall take precedence.

MW-SLA-1J ・・・ MONO WIRELESS Software License Agreement (for commercial use)
MW-OSSLA-1J ・・・ MONO WIRELESS Open Source Software License Agreement (includes non-commercial use)
MW-SLA-1E1, MW-OSSLA-1E・・・ English versions of the above

Please check the license description in the source code to understand which license applies.
- Source code created by MONO WIRELESS Inc. is generally licensed under MW-SLA or MW-OSSLA.
For licenses related to tools, refer to the distribution directory of the TWELITE STAGE SDK.
- The license for the TWELITE STAGE APP is located under MWSTAGE/TWELITE_Stage/LICENSE.

Pin Assignment

Pin Number

SMD

DIP

Functions of Each Pin

ALL

The representative functions are shown in the table below.

Name	Function
PIO	Peripheral input/output
PWM	Pulse-width modulation output
TXD	UART Data Transmission
RXD	UART Data Reception
RTS	UART Request to Send (output)
CTS	UART Clear to Send (input)
SCL	I2C Serial Clock
SDA	I2C Serial Data
SCK	SPI Serial Clock
MOSI	SPI Controller Output (PICO)
MISO	SPI Controller Input (POCI)
SSELN	SPI Peripheral Select (CS)

Name	Function
IO	Quad SPI Serial Data
CSN	Quad SPI Chip Select
CLK	Quad SPI Serial Clock
MAT	Timer Output
CAP	Timer Input
OUT	Comparator Output
ACP	Comparator + Input
ACM	Comparator - Input
SWDIO	SWD Serial Data
SWO	SWD Trace Port
SWCLK	SWD Serial Clock
ISPENT	ISP Entry
ISPSEL	ISP Mode Select

The typical function assignments are shown in the following table.

SMD # Note 1	DIP # (14P) Note 1	IO Note 2	PWM Note 3	ADC Note 3	UART Note 3	I2C Note 3	SPI Note 3	Quad SPI Note 3	Timer (CT32) Note 3	Comparator Note 3	SWD ISP Note 3
1	6	PIO0	PWM0		TXD1		SCK1
2	7 (PRG)	PIO5			RTS0		SSELN0 MISO1 SSELN1(2)				ISPENT
3	5	PIO2	PWM2		RXD0		SCK0 MOSI1
4	8	PIO3	PWM3		TXD0		MISO0 SSELN1(0)
5	28 (VCC)	VCC
6	9	PIO7	PWM7		CTS0 RXD1	SDA1	MISO0		CT32B1 MAT1
7	4	PIO6	PWM6		RTS0 TXD1	SCL1	SCK0		CT32B1 MAT0
8	10 (TXD)	PIO8	PWM8		TXD0		MOSI0		CT32B0 MAT0	OUT
9	3 (RXD)	PIO9	PWM9		RXD0		SSELN0		CT32B1 CAP1
10	11 (A)	PIO14	PWM1	ADC0			SSELN1(1)		CT32B0 CAP1		SWO
11	12	PIO12	PWM0			SCL1	MOSI0			OUT	SWCLK
12	13	PIO4	PWM4		CTS0		MOSI0 SSELN1(1)				ISPSEL
13	15 (SET)	PIO13	PWM2			SDA1	MOSI0				SWDIO
14	2	PIO10			TXD1	SCL0	SCK0		CT32B0 CAP0
15	16	PIO1	PWM1		RXD1		MISO1
16	17	PIO0	PWM0		TXD1		SCK1
17	19	PIO11			RXD1	SDA0	MISO0		CT32B1 CAP0
18	18	PIO20	PWM8		TXD1			IO2		ACP
19	20	PIO21	PWM9					IO1		ACM	SWO
20	1,14	GND
21	21 (RST)	RSTN
22	24 (A)	PIO14	PWM1	ADC0			SSELN1(1)		CT32B0 CAP1		SWO
23	22 (B)	PIO15	PWM3	ADC1		SCL0	SCK1			OUT
24	23 (C)	PIO16	PWM5	ADC2		SDA0	SSELN1(0)	CSN
25	25 (D)	PIO17	PWM6	ADC3			MOSI1	IO3			SWO
26	26 (E)	PIO18	PWM7	ADC4	TXD0		MISO1	CLK	CT32B0 MAT1
27	27	PIO19	PWM4	ADC5	RXD0 RXD1			IO0
28	1,14 (GND)	GND
29	N/A (ANT R)	LA
30	1,14 GND	GND
31	N/A (ANT L)	LB
32	1,14 GND	GND

Note 1. These are the pin numbers. TWELITE and TWELITE DIP have different counts and assignments. IO names are generally used to identify pins.

Note 2. IO names of the pins. These names are used in semiconductor datasheets and TWELITE application development. Our technical support also refers to pins by IO names in principle.

Note 3. This table lists representative functions. Only a subset is supported in the TWENET library.

To maintain compatibility with TWELITE BLUE/RED series, the following pins are internally connected:

PIO0: SMD#1 and SMD#16
PIO14: SMD#10 and SMD#22

Since ADC pins share PIO pins, internal pull-up must be disabled to read analog voltages.

It is recommended to connect all GND pins: SMD#28, 30, and 32.

Even if these pins are left unconnected, no significant changes in wireless performance have been observed.

Electrical Characteristics

ALL

Absolute Maximum Ratings

	Min	Max
Power Supply	-0.3	3.96	V
Reset	-0.3	3.96	V
Digital I/O	-0.3	3.96	V
ADC	-0.3	3.96	V
NFC (LA/LB)	-0.3	4.6	V

Values are based on the semiconductor datasheet.

Recommended Operating Conditions

	Symbol	Condition	Min	Max
Supply Voltage	VCC		1.9	3.6	V
Operating Temp	T_J	No condensation MW-G-W	-40	105	°C
		No condensation MW-G-U	-40	90	°C

Values are based on the semiconductor datasheet.

DC Characteristics

	Symbol	Condition	Typ
Current Cons.	I_CC	Sleep, SRAM not retained, no timer	350	nA
		Sleep, SRAM not retained, with timer	800	nA
		Sleep, 4KB SRAM retained, with timer	1025	nA
		Sleep, 8KB SRAM retained, with timer	1120	nA
		Active, TX (10dBm)	20.28	mA
		Active, TX (3dBm)	9.44	mA
		Active, TX (0dBm)	7.36	mA
		Active, RX	4.3	mA

Values are based on the semiconductor datasheet.

I/O Characteristics

	Symbol	Condition	Min	Typ	Max
PIO Pull-up Resistor	R_pu(int)(PIO)		40	50	60	kΩ
RSTN Pull-up Resistor	R_{pu(int)(RSTN)}		40	50	60	kΩ
PIO Pull-down Resistor	R_{pdn(int)(PIO)}		40	50	60	kΩ
IO Input High	V_IH		0.7 * VCC		VCC	V
IO Input Low	V_IL		-0.3		0.27 * VCC	V
IO Output High	V_OH	PIO0-9,12-16, 2mA load (VCC=3.6V)	3.3		VCC	V
		PIO0-9,12-16, 2mA load (VCC=3.0V)	2.65		VCC	V
		PIO0-9,12-16, 2mA load (VCC=2.4V)	2.0		VCC	V
		PIO0-9,12-16, 2mA load (VCC=1.9V)	1.4		VCC	V
		PIO17-21, 5mA load (VCC=3.6V)	3.2		VCC	V
		PIO17-21, 5mA load (VCC=3.0V)	2.6		VCC	V
		PIO17-21, 5mA load (VCC=2.4V)	2.05		VCC	V
		PIO17-21, 5mA load (VCC=1.9V)	1.35		VCC	V
		PIO10,11, 2mA load (VCC=3.6V)	3.3		VCC	V
		PIO10,11, 2mA load (VCC=3.0V)	2.66		VCC	V
		PIO10,11, 2mA load (VCC=2.4V)	2.1		VCC	V
		PIO10,11, 2mA load (VCC=1.9V)	1.15		VCC	V
IO Output Low	V_OL		0		0.4	V

Values are based on the semiconductor datasheet.

ADC Characteristics

	Symbol	Condition	Min	Typ	Max
Input Voltage	V_i		0		VCC	V
Full Scale Range	FSR	After calibration	3.56	3.6	3.62	V
Resolution					12	bits
Current Consumption	I_ADCx	x=05		100		µA
Integral Non-linearity	INL			1.1		LSB
Differential Non-linearity	DNL			0.85		LSB
Offset Error	E_O	After calibration	-4.5		4.5	mV
Gain Error	E_G	After calibration	-40	0	20	mV
Sampling Frequency	f_s	Single channel	78.4	100	190	ksps

Values are based on the semiconductor datasheet.

Mechanical Characteristics

External Dimensions

SMD

Dimensions: 13.97mm x 13.97 mm x 2.5mm
Weight: 0.84g (MW-G-W), 0.86g (MW-G-U)

DXF data for the TWELITE BLUE / RED / GOLD series (SMD) external shapes can be downloaded from our website.

DIP

Dimensions: 44.7mm x 18.3 mm x 8.1mm
Weight: 3.81g (MW-G-DIP-P), 3.83g (MW-G-DIP-U)

Recommended Pad Dimensions

SMD

Do not place silk screen or through-holes on the receiving PCB area that contacts the back of the module.
When connecting wire antennas such as matchstick antennas, create a rectangular hole in the receiving PCB and solder from the back side. (See Antenna Mounting Opening)
Use a metal mask thickness in the range of t = 0.12 to 0.15mm. Depending on the metal mask and reflow conditions, solder fillets may not form on some half-holes of the module.

Environmental Regulations

RoHS (10 substances) compliance is planned (note: under analysis).

Shield Can

The shield can is soldered at two diagonal points.

The shield can may have a thin solder plating on the top surface. This does not affect functionality. Please be aware in advance.

Antenna Mounting Opening

SMD

To connect a matchstick or similar wire antenna when mounting TWELITE on a custom board, create an opening on the board and solder from the back side.

The following figure is one example of such an opening.

In this example, pins 29, 30, 31, 32 (LA, GND, LB, GND) are left unconnected to allow for a larger opening.

Reflow Conditions

SMD

Reflow soldering is the recommended method for mounting.

Recommended Reflow Profile

Reflow Profile

Preheating	Main Heating	Peak Temp	Reflow Count
150~~180°C/60~~90sec	220°C/30-45sec	245°C	1

We have confirmed through our mounting evaluation that the above profile poses no issues, but please verify under your actual mounting conditions.

Ordering Information

Sales Code

ALL

Product Name	Sales Code	Sales Type	Packaging	MOQ	SPQ
TWELITE	MW-G-W	Retail	Individual Pack	1	1
	MW-G-W-BULK	Wholesale	Cut Tape / Tray	100	100
	MW-G-W-REEL	Wholesale	Reel	1000	1000
	MW-G-U	Retail	Individual Pack	1	1
	MW-G-U-BULK	Wholesale	Cut Tape / Tray	100	100
	MW-G-U-REEL	Wholesale	Reel	1000	1000
TWELITE DIP	MW-G-DIP-P	Retail	Individual Pack	1	1
	MW-G-DIP-P-BULK	Wholesale	Tray	100	100
	MW-G-DIP-U	Retail	Individual Pack	1	1
	MW-G-DIP-U-BULK	Wholesale	Tray	100	100

Sales codes are subject to change. Please refer to our website for the latest information.

Packaging

SMD

Taping Dimensions

Reel Dimensions

Notes

Mounting Precautions

SMD

The recommended number of reflows is one. During reflow, internal solder may re-melt; handle with care.
This product is moisture-sensitive. Please perform reflow within 72 hours after opening.
Use proper anti-static precautions.
If 72 hours have passed after opening, perform a baking process under the following conditions before use:
- Do not bake in the reel. Transfer to a tray or similar.
- Bake at 90°C for 48 hours, only once.
Multiple LOT numbers may be mixed in one package.
Presence or absence of solder fillets on mounted parts is not guaranteed.
Designed for mounting on FR-4 (glass epoxy). If using a different substrate (e.g., ceramic), evaluate thoroughly beforehand.
Components mounted inside the product are highly sensitive to static electricity. Ensure sufficient static protection.
The shield case may come off under stress. Please handle with care.
For hand soldering, follow these conditions: ≤350°C, ≤3 seconds (≤150°C on package surface).

Export Control

ALL

The AES encryption circuit in TWELITE falls under controlled goods. Contact us for the parameter sheet.
Depending on the destination, radio certification may be required for customs clearance. Contact us regarding country-specific regulations.

Product Marking

ALL

Product logos and certification numbers printed on the product may change without notice.

Factory Default Firmware

ALL

TWELITE (MW-G-W/U, MW-G-DIP-P/U) is shipped with the “Extremely Simple! Standard App (App_Twelite)” pre-installed (at the time of this datasheet’s creation). This app is written during manufacturing to verify chip configuration (e.g., serial number and MAC address), and firmware version information will not be disclosed upon request.

Please note that the presence or type of pre-installed firmware may change without notice. Always write the necessary firmware in your own manufacturing process. We do not provide reflashing services for shipped products.

Storage Precautions

ALL

Store at temperatures between 0°C and 40°C, avoiding high temperature and humidity.

SMD

Use the product within 6 months of delivery.

Usage Notes

ALL

Always evaluate and verify in your actual usage environment. For high-reliability or life-critical applications, consult your distributor beforehand.

Revision History

Version	Date	Description
1.0.0rc2	2024-07-16	Initial version released

Arm® and Cortex® are registered trademarks of Arm Limited.

NXP® and NTAG® are registered trademarks of NXP B.V.